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Theses

Conception et réalisation de fonctions thermiques intégrées dans le
substrat de composants électroniques de puissance. Apport de la
gestion des flux thermiques par des mini et micro caloducs.

Abstract : Today the thermal losses of power electronic devices increase at the same time with the decreasing
of their sizes. Consequently heat sinks have to dissipate very large heat flux densities. Flat heat pipes
present an interesting issue for space applications, where the criteria of mass, obstruction and electric
insulation are of primary importance. The aim of the work presented in this PhD thesis is to realize the
design and the study of mini and micro heat pipes. In the first part of this work, theoretical and
experimental studies were led for the conception and realization of silicon micro heat pipes. The second
part of this research was the design, fabrication and characterisation of the heat pipes imbedded in Direct
Bonded Copper substrate (DBC). The presented work showed all the contribution of the mini and micro
heat pipes in the electronic systems thermal management.
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Submitted on : Thursday, September 13, 2007 - 1:48:50 PM
Last modification on : Thursday, November 19, 2020 - 1:00:25 PM
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Mariya Ivanova. Conception et réalisation de fonctions thermiques intégrées dans le
substrat de composants électroniques de puissance. Apport de la
gestion des flux thermiques par des mini et micro caloducs.. Energie électrique. Institut National Polytechnique de Grenoble - INPG, 2005. Français. ⟨tel-00171856⟩

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