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ETUDE EXPERIMENTALE ET NUMERIQUE
DES PHENOMENES DE FISSURATION DANS LES INTERCONNEXIONS DE LA MICROELECTRONIQUE

Abstract : The aim of this work is to better understand and predict the mechanical failures, by crack initiation and propagation due to the scale reduction in integrated circuits, using fracture mechanics applied to microelectronic. The scientific approach to discuss the mechanical integrity of complex structures such as interconnects, is conducted in two steps.

- Understanding and characterizing crack phenomena in brittle low-k thin films by two experimental methods nanoindentation and multicracking by four points bending test. The toughness values thus obtained, as the most severe, are necessary to estimate the failure risk of an interconnect structure.
- With the help of Finite Element numerical techniques, estimating the risk of structure integrity loss. A first one is based on nucleation criterion at geometrics and materials singularities. A second one is based on pre-existing crack propagation energy criteria.

These results obtained allow establishing general features for the influence of interconnect architecture on their failure risk.
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https://tel.archives-ouvertes.fr/tel-00168451
Contributor : Brillet-Rouxel Helene <>
Submitted on : Tuesday, August 28, 2007 - 2:24:37 PM
Last modification on : Thursday, November 19, 2020 - 3:54:17 PM
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Brillet-Rouxel Helene. ETUDE EXPERIMENTALE ET NUMERIQUE
DES PHENOMENES DE FISSURATION DANS LES INTERCONNEXIONS DE LA MICROELECTRONIQUE. Matériaux. Université Joseph-Fourier - Grenoble I, 2007. Français. ⟨tel-00168451⟩

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