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Intégration de microcaloducs plats pour le refroidissement des packaging

Abstract : The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. This thesis work is devoted to the cooling of electronic substrates, stacked in a 3D module, and and to the integration of thermal functions, such as flat heat pipes, in these substrates. This research study in concentrated more particularly on the design, the fabrication and the experimental evaluation of miniature very thin metal heat pipes. Experimental and modelling results showed that the studied heat pipes eliminate hot spots and spread the heat dissipated from the components in a very efficient way. New fabrication techniques of flat heat pipes with sintered capillary wicks have been developed. This thesis work allows showing that the integration of heat pipesin very thin electronic substrates is possible and very interesting solution for the thermal management of electronics devices for avionics applications.
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Submitted on : Monday, July 16, 2007 - 3:49:48 PM
Last modification on : Thursday, November 19, 2020 - 1:00:25 PM
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  • HAL Id : tel-00163012, version 1



Nataliya Popova. Intégration de microcaloducs plats pour le refroidissement des packaging
tridimensionnels. Energie électrique. Institut National Polytechnique de Grenoble - INPG, 2006. Français. ⟨tel-00163012⟩



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