, An Integrated Environment for the Simulation of Electrical, Thermal and Electromagnetic Interactions in High- Performance Integrated CircuitsElectrothermal simulation and design of integrated circuits Solid-State CircuitsElectro- Thermal Circuit Simulation Using Simulator CouplingElectro-Thermal Modelling and Simulation of a Power-MOSFETElectro-thermal simulation using a circuit simulator and modified Spice3 semiconductor model library, IEEE 6th Topical Meeting on Electrical Performance of Electronic Packaging IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS 5th inter. conf. MIXEDS'98Fully Analytical Compact Thermal Model of Complex Electronic Power Devices and Packages in Coupled Electrothermal CAD 13th workshop on physical simulation of semiconductor devices, pp.785-790, 1997.
, Self hetaing effects in Mos circuits: Spice simulation using VHDL-AMS modeling " in 5th inter. Conf. MIXDES'98VHDL-AMS Design of a MOST Model Including Deep Submicron and Thermal-Electronic Effects, IEEE inter. workshop on Behavioral Modeling and simulation BMAS, pp.199-203, 1998.
, New method for electrothermal simulations: HDTMOS in automotive applications, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545), 2004.
DOI : 10.1109/STHERM.2004.1291310
, New electro-thermal modeling method for IGBT power module, BCTM, 2004.
, Global Coupled EM?Electrical? Thermal Simulation and Experimental Validation for a Spatial PowerCombining MMIC Array, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2002.
, Static and dynamic thermal modeling of ICs, Microelectronics Journal, vol.30, issue.11, 1999.
DOI : 10.1016/S0026-2692(99)00069-5
, An analytical method for the thermal layout optimisation of multi-layer structure solid-state devices, Solid-State Electronics, vol.45, 2001.
, Application of Green's functions for analysis of transient thermal states in electronic circuits, Microelectronics Journal, vol.33, issue.9, 2002.
DOI : 10.1016/S0026-2692(02)00057-5
, THESE: Modèles thermiques et méthodologie d'analyse thermique pour circuits intégrés de puissance de type "SmartPower, p.449, 1998.
, Choosing a Thermal Model for Eiectrothermal Simulation of Power Semiconductor Devices, IEEE traNSACTICINS ON Power electronics, vol.14, 1999.
, Rebeca-3D, The Software for Conductive Fluxes and Temperature Fields Prediction, SAE Technical Paper Series, 1996.
DOI : 10.4271/961451
, REBECA-3D: the thermal conductive solver for microelectronics, Microelectronics Journal, vol.29, issue.9, 1998.
DOI : 10.1016/S0026-2692(98)00030-5
, Developing an equivalent thermal model for discrete semiconductor packages, International Journal of Thermal Sciences, vol.42, issue.5, 2002.
DOI : 10.1016/S1290-0729(02)00053-4
, Thèse: Static and Dynamic Thermal Behavior of IGBT Power Modules, 2000.
, Identification of RC networks by deconvolution: chances and limits, IEEE Transactions on Circuits and Systems I: Fundamental Theory and Applications, vol.45, issue.3, 1998.
DOI : 10.1109/81.662698
, Thermal Component Models for Electrothermal Network Simulation, IEEE TRANSACTIONS ON COMPONENTS. PACKAGING. AND MANUFACTURING TECHNOLOGY-PART A, vol.17, 1994.
, Thermal resistance calculation in Multilayer substrates, MIXDES 98 5th international conference, 1998.
, A closed form solution of junction to substrate thermal resistance in semiconductor chips, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol.19, issue.4, 19961996-12.
DOI : 10.1109/95.554935
, Channel temperature model for microwave AlGaN/GaN power HEMTs on SiC and sapphire, 2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535), 2004.
DOI : 10.1109/MWSYM.2004.1339012
, Coupled electro-thermal modeling and optimization of clock networks, Microelectronics Journal, vol.34, 2003.
, Final Report to SEMITHERM XI11 on the European-Funded Project DELPHI -the Development of Libraries and Physical Models for an Integrated Design Environment, Thirteenth IEEE SEMI-THERMTM Symposium, 1997.
, The world of thermal characterization according to DELPHI-Part I: Background to DELPHI, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol.20, issue.4, 19971997.
DOI : 10.1109/95.650927
, Tjc Characterization of Chip Packages-Justification, Limitations, and Future, IEEE TRANSACTIONS ON COMPONENTS, HYBRIDS, AND MANUFACTURING TECHNOLOGY, vol.12, 1989.
, Thermal Characterization of Chip Packages? Evolutionary Development of Compact Models, IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY?PART A, vol.4, 1997.
, Recent achievements in the thermal characterization of electronic devices by means of boundary condition independent compact models, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium, 1997.
DOI : 10.1109/STHERM.1997.566780
, Compact models for accurate thermal characterization of electronic parts, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol.20, issue.4, 19971997.
DOI : 10.1109/95.650930
, Thermal characterization of electronic devices with boundary condition independent compact models, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol.18, issue.4, 19951995-12.
DOI : 10.1109/95.477457
, RéférencesThermal Characterization of a Radial Micro-Channel Cooling PlateThe World of Thermal Characterization According to DELPHI?Part I: Background to DELPHIThermal characterization of electronic Devices with Boundary Condition Independent Compact ModelsFinal Report to SEMITHERM XI11 on the European-Funded Project DELPHI -the Development of Libraries and Physical Models for an Integrated Design EnvironmentThermal resistance calculation in Multilayer substratesTransient response damped linear networks particular regard wideband amplifiers, Boundary Independent Compact Thermal Models for Active Components According to the DELPHI / SEED Methods 21st IEEE SEMI-THERM Symposium Thirteenth IEEE SEMI-THERMTM Symposium MIXDES 98 5th international conferenceChannel Temperature Model for Microwave AlGaN/GaN HEMTs on SiC and Sapphire MMICs in High Power, High Efficiency SSPAs International Microwave SymposiumThèse: Static and Dynamic Thermal Behavior of IGBT Power Modules Zurich: Swiss fedral institute of thechnologyIdentification of RC Networks by Deconvolution: Chances and Limits IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS?I: FUNDAMENTAL THEORY AND APPLICATIONS, 1948.
, Thermal Investigation of High Power Optical Devices by Transient Testing, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, vol.28, 2005.
, New possibilities in the thermal evaluation, offered by transient testing, Microelectronics Journal, vol.34, issue.3, 2003.
DOI : 10.1016/S0026-2692(02)00185-4
, THERMODEL: a tool for compact dynamic thermal model generation, Microelectronics Journal, vol.29, issue.4-5, 1997.
DOI : 10.1016/S0026-2692(97)00065-7
, A 'Textbook' Computerized State-Space Network Analysis Algorithm, IEEE Transactions on Circuit Theory, vol.16, issue.4, 19691969-10.
DOI : 10.1109/TCT.1969.1083022
, Thermal Transient Modeling and Experimental Validation in the European Project PROFIT, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, vol.27, 2004.
, Compact models for accurate thermal characterization of electronic parts, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol.20, issue.4, 19971997.
DOI : 10.1109/95.650930
, A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, vol.21, issue.4, 19981998.
DOI : 10.1109/95.740049
, Discontinuous Optimization, Encyclopedia of Optimization, vol.1, pp.453-458, 2001.
DOI : 10.1007/978-0-387-74759-0_130
URL : https://hal.archives-ouvertes.fr/inria-00076929
, nous avons présenté l'erreur générée par le modèle thermique de structures minces avec une seule surface de refroidissement. En supposant que le changement de la surface effective en fonction du coefficient d'échange convectif h est linéaire (où h varie entre 5 et 10000 W/m².K), nous pouvons programmer un bloc en VHDL-AMS, où les surfaces S iso et S total (voir II-5) sont définies
, (Siso-Stotal)/10000.0)*h) +Stotal)))*I
, REBECA-3D 1-the thermal conductive solver for microelectronicshttp://www.comsol.com/products, Application Note:: MicroSime Corporation Newsletter, pp.651-656, 1989.
, Boundary condition independent dynamic compact models of packages and heat sinks from thermal transient measurements, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003), 2003.
DOI : 10.1109/EPTC.2003.1271568
URL : https://hal.archives-ouvertes.fr/hal-00007819
, Advanced Compact Thermal models for Multi-chips Systems 1st European Advanced Technology Workshop on Micropackaging and Thermal Management, HABRA ? Transient compact modelling for multi chips components 11th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC'2005), Belgirate (Italie), pp.27-30, 2005.
, DORKEL ? Improved 3D-nonlinear compact modelling for power components EuroSimE, p.4, 2005.
, DORKEL Quantity Vdw2b across Idw2b through D2 to Dw2; Quantity Vy2 across Iy2 through D2 to Ground; Quantity Vs2 across Is2 through IN2 to S2; Quantity Vs2b across Is2b through S2 to Side2
, (Siso-Stotal)/10000.0)*h)+Stotal)))*I