P. Synthèse-des, 37 II-1-1, p.38

.. Effet-de-la-réaction-d-'imidisation, 111 IV-3-1. Rôle de l'acide polyamique résiduel, p.112

. Dépôt-résine-tournette-4000tr-/-min, recuit de la résine 100°C ? 60sec Insolation de la résine Alignement du masque de gravure. Insolation des parties exposées aux UV pendant 5sec

. Gravure, Alu non protégé Bain d'attaque de l'aluminium mis dans un bac à ultrasons

A. Tableau, 1 : Les différentes étapes de photolithogravure de l'aluminium, pour la formation des électrodes supérieures de la structure de tests électriques MIM

]. J. Mooken, Future Vehicles Drive Next Generation of Power Modules Disponible sur internet à l'adresse suivante : http://www.semikron.com/internet/index.jsp?sekId=144 [2] Documentation technique de Mitsubishi Electric (1998), disponible sur internet à l'adresse suivante : http://www.mitsubishichips.com/Global/note/power.html [3] R.W. De Doncker : Recent developments of power electronics components for high power applications, Références Bibliographie Références bibliographiques, pp.34-37, 1999.

]. S. Hodge, SiC schottky diodes in power factor correction Disponible sur internet à l'adresse suivante : http://powerelectronics.com/mag/power_sic_schottky_diodes_3, The Industrial Utilization of SiC Power Devices -Aspects and Prospects. Workshop on Future Electron Devices (FED), pp.14-18, 2003.

]. E. Johnson, Physical limitations on frequency and power parameters of transistors, IRE International Convention Record, pp.163-177, 1965.
DOI : 10.1109/IRECON.1965.1147520

K. Shenai, R. S. Scott, and B. J. Baliga, Optimum semiconductors for high-power electronics, IEEE Transactions on Electron Devices, vol.36, issue.9, pp.1811-1823, 1989.
DOI : 10.1109/16.34247

S. Carubelli, Contribution à l'identification et à l'estimation des contraintes de fatigues thermiques des convertisseurs intégrés pour la traction électrique, Thèse de doctorat de l'université Henri Poincaré de Nancy I, 2003.

F. Breit, Contribution a l'intégration hybride de puissance : étude de l'environnement diélectrique des semi-conducteurs, Thèse de doctorat de l'université Paul Sabatier de Toulouse, 2003.

E. Collard and A. , Lhorte : Diode schottky SiC 8A/600V : Réalisation, caractérisation électrique et évaluation en fiabilité, 2000.

M. Massenat, Multi Chip Modules d'hier et de demain, Polytechnica, 1994.

P. Jacob, M. Held, and P. , Scacco: IGBT power semiconductor reliability analysis for traction application, IEEE Proc. 5 th Inter. Symp on the Physical and Failure Analysis of IC, pp.169-175, 1995.

H. Kirihata, Y. Takahashib, H. Wakimotob, and F. Niino, Investigation of flat-pack IGBT reliability, Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242), pp.1016-1021, 1998.
DOI : 10.1109/IAS.1998.730270

D. Stephani and P. , Friedrichs : Unipolar SiC power devices and elevated temperature, rd International Conference on Materials for Advanced Technologies, ICMAT 2005, pp.3-8, 2005.

I. W. Qin, Wire Bonding: the Preferred Interconnect Method Chipscale Review, Novembre-decembre 2002. Disponible sur internet à l'adresse suivante

B. Boursat, Problématique de l'assemblage et de l'intégration hybride en électronique de puissance, Conférence Master Professionnel 2 EP, 2005.

R. W. Johnson, Y. Liu, and C. , Wang : Packaging of electronics for extreme environment applications, Proc. HITEN 2005, 2005.

L. A. Lipkin and J. W. Palmour, Insulator investigation on SiC for improved reliability, IEEE Transactions on Electron Devices, vol.46, issue.3, pp.525-532, 1999.
DOI : 10.1109/16.748872

M. Locatelli, K. Isoird, S. Dinculescu, V. Bley, and T. , Lebey : Study of suitable dielectric material properties for high electric field and high temperature power semiconductor environment, pp.897-905, 2003.

S. Zelmat, M. Locatelli, and T. Lebey, Characterization of polyimide dielectric layer for the passivation of high electric field and high temperature silicon carbide power devices, Materials Science Forum, pp.483-485, 2005.

P. G. Neudeck, R. Okojie, and L. Y. Chen, High-temperature electronics - a role for wide bandgap semiconductors?, Proc. of the IEEE, pp.6-1065, 2002.
DOI : 10.1109/JPROC.2002.1021571

D. Soane and Z. , Martynenko : Polymers in microelectronics : Fundamentals and applications, 1989.

C. E. Sroog, A. Endey, V. Abramo, C. Berr, W. Edwards et al., Aromatic polypyromellitimides from aromatic polyamic acids, J.Polymer science, pp.1373-1390, 1965.
DOI : 10.1002/pol.1965.100030410

P. Merot, Polyimides linéaires, 1990.

R. Tummala-;-rymaszewski and E. J. , Microelectronics Packaging Handbook: Semiconductor Packaging, Pt. II

C. Wong, Polymers for electronic and photonic applications, 1993.

G. Rabilloud, High performance polymers, chemistry and applications, Polyimides in electronics, Edition Technip, 2000.

G. Rabilloud, High performance polymers, chemistry and applications, Polyquinoxalines and polyimides, Edition Technip, 1999.

H. Anderson, M. M. Khojasteh, T. P. Mcandrew, and G. , Sachdev: Polyimide-Substrate Bonding Studies Using ?-APS Coupling Agent, IEEE Trans. On Components, Hybrids, and Manufacturing Technology, issue.4, 1986.
DOI : 10.1109/tchmt.1986.1136662

I. George, P. Viel, C. Bureau, J. Suski, and G. , Lecayon: Study of the Silicon/ ?-APS/Pyralin Assembly Interfaces by X-ray Photoelectron Spectroscopy Surface And Interface Analysis, pp.774-780, 1996.

K. Miyazaki, O. Miura, and U. Satu, Adhesion of thin film metals on low thermal expansion polyimide. 176th meeting of Electronic Chemical Society, Abstract N°, p.220, 1989.

K. D. Farnsworth, R. N. Manepalli, S. A. Bidstrup-allen, and P. A. Kohl, Variable frequency microwave curing of 3,3',4,4'-Biphenyltetracarboxylic Acid Dianhydride, The International Journal of Microcircuits and Electronic Packaging, vol.23, pp.2-162, 2000.

K. Chen, T. Wang, and J. King, Effect of imidization temperature on properties of polymide films, Journal of Applied Polymer Science, vol.48, issue.2, pp.291-297, 1993.
DOI : 10.1002/app.1993.070480213

W. Xie, R. Heltsley, H. Li, C. Lee, and W. , Study of the processing chemistry of polyimides with thermogravimetry/Fourier transform infrared/mass spectrometry techniques, Journal of Applied Polymer Science, vol.8, issue.10, pp.2213-2224, 2002.
DOI : 10.1002/app.10190

M. C. Wilson, Short course on polyimides for microelectronic applications, 1981.

H. Microsystems, Fiche technique du fabricant du polyimide : PI 2600 LX series ? Low stress polyimides, Product information and process guidelines, 1999.

Y. Ito, M. Hikita, T. Kimura, and T. Mizutani, Effect of Degree of Imidization in Polyimide Thin Films Prepared by Vapor Deposition Polymerization on the Electrical Conduction, Japanese Journal of Applied Physics, vol.29, issue.Part 1, No. 6, pp.1128-1131, 1990.
DOI : 10.1143/JJAP.29.1128

K. P. Pramoda, S. Liu, and T. Chung, Thermal Imidization of the Precursor of a Liquid Crystalline Polyimide, Macromolecular Materials and Engineering, vol.287, issue.12, pp.931-937, 2002.
DOI : 10.1002/mame.200290027

T. Hsu and Z. Liu, Solvent effect on the curing of polyimide resins, Journal of Applied Polymer Science, vol.46, issue.10, pp.1821-1833, 1992.
DOI : 10.1002/app.1992.070461014

L. Kan and K. C. Kao, Ultraviolet absorption and photoconduction spectra of polyimide films fabricated at various curing temperatures, The Journal of Chemical Physics, vol.98, issue.4, pp.3445-51, 1993.
DOI : 10.1063/1.465070

T. J. Shin, B. Lee, H. S. Youn, K. Lee, and M. Ree, Time-Resolved Synchrotron X-ray Diffraction and Infrared Spectroscopic Studies of Imidization and Structural Evolution in a Microscaled Film of PMDA-3,4???-ODA Poly(amic acid), Langmuir, vol.17, issue.25, pp.7842-50, 2001.
DOI : 10.1021/la0108656

J. C. Coburn, M. T. Pottiger, A. E. Nader, and C. A. , The Effect of Photoreactive Substituents on the Morphological Structure and Properties of BPDA-PPD Based Polyimides, MRS Proceedings, vol.5, pp.107-115, 1992.
DOI : 10.1002/pola.1989.080270229

D. Dunson, Synthesis and characterization of thermosetting polyimide oligomers for microelectronics packaging, 2000.

I. Karamancheva, V. Stefov, B. Soptrajanov, G. Danev, E. Spasova et al., FTIR spectroscopy and FTIR microscopy of vacuum-evaporated polyimide thin films, Vibrational Spectroscopy, vol.19, issue.2, pp.369-374, 1999.
DOI : 10.1016/S0924-2031(99)00011-9

M. C. Buncick and D. D. Denton, Effects of aging on polyimide: A study of bulk and interface chemistry, Journal of Applied Polymer Science, vol.46, issue.2, pp.271-280, 1992.
DOI : 10.1002/app.1992.070460208

G. D. Hietpas, J. M. Sands, and D. L. , A Vibrational Spectroscopic Study of Molecular Restructuring at Surfaces of Unidirectionally Rubbed Polyimide Thin Films, The Journal of Physical Chemistry B, vol.102, issue.51, pp.10556-10567, 1998.
DOI : 10.1021/jp983363i

J. O. Iroh and K. Jordan, Rate of imidization of polymerizable reaction mixtures: PMR-15, Journal of Applied Polymer Science, vol.66, issue.13, pp.2529-2538, 1997.
DOI : 10.1002/(SICI)1097-4628(19971226)66:13<2529::AID-APP15>3.0.CO;2-S

R. V. Tanikella, S. A. Bidstrup-allen, and P. A. Kohl, Novel low-temperature processing of polymer dielectrics on organic substrates by variable frequency microwave processing, 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617), pp.254-259, 2002.
DOI : 10.1109/ISAPM.2002.990396

H. Microsystems and T. , Polyimides for microelectronics Product selector guide, 2002.

S. Matsumoto, X. Z. Jin, T. Fukushima, M. Miyamura, and H. Itatani, Applications of Newly Developed Positive Photosensitive Block CO-Polyimides to CSPs, IEEE Electronics Packaging Technology Conference, 2000.

A. Elshabini-riad and F. Barlow, Thin film technology handbook, 1997.

A. Collado, X. Jorda, E. Cabruja, and P. Godignon, MCM-D package for power applications, IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426), pp.14-15, 2000.
DOI : 10.1109/IWIPP.2000.885184

C. Laurent, Diélectriques solides et charge d'espace. Techniques de l'ingénieur, p.2305, 1999.

J. K. Park, H. G. Kim, J. T. Kim, and D. C. Lee, Electrical insulation properties of the polyimide prepared by VDPM, 1999 Annual Report Conference on Electrical Insulation and Dielectric Phenomena (Cat. No.99CH36319), pp.281-284, 1999.
DOI : 10.1109/CEIDP.1999.804644

T. Yokoyama, N. Kinjo, Y. Wakashima, and Y. Miyadera, The Effect of the Polymer Coating on Residual Current of Mos Devices, IEEE Transactions on Electrical Insulation, vol.20, issue.3, pp.557-560, 1985.
DOI : 10.1109/TEI.1985.348782

D. Makino, Application of polyimide resin to semiconductor devices in Japan, IEEE Electrical Insulation Magazine, vol.4, issue.2, 1988.
DOI : 10.1109/57.822

R. J. Jensen, J. Cummings, and H. , Vora: Copper/polyimide materials system for high performance packaging, IEEE CHMT, pp.384-393, 1984.

K. Goto, T. Akiike, Y. Inoue, and M. Matsubara, Polymer design for thermally stable polyimides with low dielectric constant, Macromolecular Symposia, vol.199, issue.1, pp.321-331, 2003.
DOI : 10.1002/masy.200350927

S. A. Bidstrup-allen, T. Hodge, L. Lin, P. Kohl, J. Lee et al., Anisotropy in thermal, electrical and mechanical properties of spin coated polymer dielectrics. Material Reliability in microelectronics IV symposium, pp.577-587, 1994.

K. Patel, P. Kohl, and S. Bidstrup-allen, Three-dimensional dielectric characterization of polymer films, Journal of Applied Polymer Science, vol.35, issue.12, pp.2328-2334, 2001.
DOI : 10.1002/app.1338

S. Numata, S. Oohara, K. Fujisaki, J. Imaizumi, and N. Kinjo, Thermal expansion behavior of various aromatic polyimides, Journal of Applied Polymer Science, vol.31, issue.1, pp.101-110, 1986.
DOI : 10.1002/app.1986.070310110

H. Nomura and M. , Asano: Effect of thermal curing on thermomechanical properties of polyimide films having rodlike molecular skeleton formed on a silicon substrate

Y. Segui, Diélectriques, courants de conduction Techniques de l'ingénieur, p.2301, 2000.

C. Menguy, Mesures des caractéristiques des matériaux isolants solides, p.2310, 1997.

R. Bartnikas and R. M. Eichhorn, Engineering dielectrics, Volume IIA: Electrical properties of solid insulating materials: Molecular structure and electrical behaviour, ASTM publications, 1983.
DOI : 10.1520/STP783-EB

N. Zouzou, Etude de la mobilité moléculaire du PEN destiné à la fabrication des condensateurs : influence de la microstructure, Thèse de doctorat de l'université Paul Sabatier, 2002.

S. Martin, Mécanismes de croissance et propriétés de couches minces de silice hydrogénée réalisées par décharge luminescente à la pression atmosphérique, en mélange silane, protoxyde d'azote, azote, Thèse de doctorat de l'université Paul Sabatier, 2003.

T. Tchangai, Caractérisation électrique des films de polyamide-imide et de leurs interfaces avec un substrat semiconducteur, Thèse de doctorat de l'Université Paul Sabatier, 1988.

A. A. Goodwin, J. R. Atkinson, J. N. Hay, and F. W. Mercer, Dielectric relaxation behaviour of fluorinated aromatic poly(ether)s and poly(ether ketone)s. Polymer, 40 pp, pp.1515-1524, 1999.

R. A. Pethrick and D. Hayward, Real time dielectric relaxation studies of dynamic polymeric systems, Progress in Polymer Science, vol.27, issue.9, pp.1983-2017, 2002.
DOI : 10.1016/S0079-6700(02)00027-8

K. Miyairi, The frequency dependent dielectric breakdown in some thin polymers, Proceedings of the 7th International Conference on Properties and Applications of Dielectric Materials (Cat. No.03CH37417), pp.949-952, 2003.
DOI : 10.1109/ICPADM.2003.1218578

J. J. Dwyer, The theory of electrical conduction and breakdown in solid dielectrics, 1973.

G. Raju, A. Katebian, and S. Z. Jafri, Breakdown voltages of polymers in the temperature range 23??-250??C, IEEE Transactions on Dielectrics and Electrical Insulation, vol.10, issue.1, pp.117-127, 2003.
DOI : 10.1109/TDEI.2003.1176573

S. Cygan and J. R. Laghari, Dependence of the Electric Strength on Thickness Area and Volume of Polypropylene, IEEE Transactions on Electrical Insulation, vol.22, issue.6, pp.835-837, 1987.
DOI : 10.1109/TEI.1987.298949

A. Society and M. Testing, Dielectric breakdown voltage and dielectric strength of electrical insulating materials at commercial power frequencies. D149-64, Book of ASTM Standards Part 29 Electrical insulating materials, 1969.

S. J. Laihonen, Polypropylene : Morphology, defects and electrical breakdown, Royal institute of technology. Stockholm, 2005.

K. Kato, X. Han, and H. Okubo, Insulation optimization by electrode contour modification based on breakdown area/volume effects, IEEE Transactions on Dielectrics and Electrical Insulation, vol.8, issue.2, pp.162-167, 2001.
DOI : 10.1109/94.919913

Y. Isono and H. Nakano, Measurement of tunneling current through Al/polyimide Langmuir???Blodgett film/Al structure, Journal of Applied Physics, vol.75, issue.9, pp.4557-4559, 1994.
DOI : 10.1063/1.355949

J. Lee, C. Kim, S. Lee, J. Wang, D. Kim et al., Non-linear conduction properties of polytetrafluoroethylene film, Conference Record of the 1992 IEEE International Symposium on Electrical Insulation, pp.149-152, 1992.
DOI : 10.1109/ELINSL.1992.247032

J. R. Hanscomb and J. H. Calderwood, Thermally assisted tunnelling in polyimide film under steady-state and transient conditions, Journal of Physics D: Applied Physics, vol.6, issue.9, pp.1093-1104, 1973.
DOI : 10.1088/0022-3727/6/9/314

G. Sawa, S. Nakamura, K. Iida, and M. , Electrical Conduction of Polypyromellitimide Films at Temperatures of 120-180??C, Japanese Journal of Applied Physics, vol.19, issue.3, pp.453-458, 1980.
DOI : 10.1143/JJAP.19.453

E. Motyl and R. Kacprzyk, On the electrical conduction in polyimide, 9th International Symposium on Electrets (ISE 9) Proceedings, pp.608-613, 1996.
DOI : 10.1109/ISE.1996.578175

G. M. Sessler, B. D. Hahn, and . Yoon, Electrical conduction in polyimide films, Journal of Applied Physics, vol.60, issue.1, pp.318-326, 1986.
DOI : 10.1063/1.337646

M. Ree, K. Kim, S. H. Woo, and H. , Structure, chain orientation, and properties in thin films of aromatic polyimides with various chain rigidities, Journal of Applied Physics, vol.81, issue.2, pp.698-708, 1997.
DOI : 10.1063/1.364210

M. Nagao, G. Sawa, and M. Ieda, Dielectric breakdown of polyimide film in high-temperature region, Electrical Engineering in Japan, vol.85, issue.3, pp.7-11, 1977.
DOI : 10.1002/eej.4390970302

A. Lian, L. Martinu, and M. R. , Electrical conduction in double-layer P-SiO/sub 2//polymer dielectric structures, IEEE Transactions on Dielectrics and Electrical Insulation, vol.2, issue.1, pp.62-73, 1995.
DOI : 10.1109/94.368681

E. Sacher, Dielectric Properties of Polyimide Film. II. DC Properties, IEEE Transactions on Electrical Insulation, vol.14, issue.2, pp.85-93, 1979.
DOI : 10.1109/TEI.1979.298160

B. Lee, H. Kim, and D. Lee, Electrical properties of polyimide thin films formed by the vapor deposition polymerization method, Surface and Coatings Technology, vol.150, issue.2-3, pp.182-187, 2002.
DOI : 10.1016/S0257-8972(01)01535-3

S. Zelmat, M. L. Locatelli, T. Lebey, and S. Diaham, Investigations on high temperature polyimide potentialities for silicon carbide power device passivation, Microelectronic Engineering, vol.83, issue.1, pp.51-54, 2006.
DOI : 10.1016/j.mee.2005.10.050

A. Kuntman, T. Yilmaz, A. Gungor, and B. M. , A new polyimide film for VLSI and its electrical characterization, IEEE Transactions on Dielectrics and Electrical Insulation, vol.5, issue.2, pp.296-299, 1998.
DOI : 10.1109/94.671967

R. Shaikh and G. R. Raju, Electrical conduction in polyimide-FEP fluoropolymer films, Annual Report Conference on Electrical Insulation and Dielectric Phenomena, pp.578-581, 2002.
DOI : 10.1109/CEIDP.2002.1048862

Y. Cao and P. C. Irwin, The electrical conduction in polyimide nanocomposites, 2003 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, pp.116-119, 2003.
DOI : 10.1109/CEIDP.2003.1254808

H. J. Wintle, Basic physics of insulators, IEEE Transactions on Electrical Insulation, vol.25, issue.1, pp.27-44, 1990.
DOI : 10.1109/14.45232

D. A. Skoog and J. J. Leary, Principles of instrumental analysis, 1992.