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Application de la méthode de compression à l'analyse électromagnétique globale des effets de mise en boîtier d'amplificateurs MMIC

Abstract : The RFS (Radio Frequency Solutions) department of Thales Airborne Systems is in charge of transceiver (T/R) modules design. These T/R modules are dedicated to electronic warfare and radar applications (for instance active antenna) and use microwave monolithic integrated circuits (MMIC)(amplifiers, attenuators, mixers,....). These active circuits are packaged for protection reasons (atmospheric or EMC). Packaging must also improve the module reliability and manufacturing. Finally, packaging is more and more important in the modules design and packaging solutions must lead to cost reduction.

Unfortunately, packaging can product parasitic effects. So new simulation tools are needed in order to predict and to prevent these parasitic effects. It is necessary to use 3-D electromagnetic simulator in order to take into account complex EM phenomena produced by packages complex geometries. But EM simulation is not dedicated to active components simulation and simultaneous modeling of the package and the circuit inside the package is needed. This is the reason why a global EM simulation approach is proposed, validated and exploited.

The proposed approach is an implementation of the compression approach that links an EM and circuit simulator. Two commercial simulators are associated sequentially thanks to a numerical calibration of internal ports in the EM simulation. This simple simulation is not quite time-consuming because a single EM simulation is required in order to perform many global simulations. The active circuits may be modified or packaging effects on MMICs dispersion can be studied. The compression approach is based on the lumped element assumption. This is the keypoint of the compression approach where the so-called lumped element must be intrinsically independent of its environment. This is also verified thanks to the application of the compression approach at different scale (at the package scale or at the MMIC scale).

Finally, the proposed compression approach is validated thanks to nonlinear as well as linear simulations of complex MMIC packaging structures. The transition and interconnection effects, and the EM coupling effects are perfectly taking into account. Design rules about packages dimensions (cover height, witdh, chip location), transition and interconnection dimensions are found thanks to these global EM simulations.
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Contributor : Jean-Marc Lesage <>
Submitted on : Tuesday, March 7, 2006 - 10:20:33 PM
Last modification on : Friday, January 8, 2021 - 3:42:06 AM
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  • HAL Id : tel-00011792, version 1


Jean-Marc Lesage. Application de la méthode de compression à l'analyse électromagnétique globale des effets de mise en boîtier d'amplificateurs MMIC. Autre. INSA de Rennes, 2005. Français. ⟨tel-00011792⟩



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