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Techniques de conception des circuits intégrés analogiques pour des applications en haute température, en technologies de conception des circuits intégrés analogiques pour des applications en haute température, en technologies sur substrat de silicium

Abstract : This Ph.D. deals with high temperature microelectronics for low-cost and high-volume applications. Present day most advanced microelectronic technologies, in terms of density, cost and reliability, still use silicon substrates. Theses technologies are designed to obtain long MTF (Mean Time to Failure) at normal temperatures: 0 to 100C, typically. Other technologies, such as Wide Bandgap Semiconductors (SiC, Diamond, etc.) and thin film SOI, are under development to provide good performance at much higher temperatures (>250C).
But, since they presently have lower performances in terms of density and cost, they are less competitive than present day silicon-substrate based technologies. In addition, it is expected for the next ten years
that more than 70% of high temperature applications will still correspond to automotive and oil prospecting applications, having intermediate operating temperatures, lower than 200C. Based on semiconductor devices and microelectronics materials physics, this work will increase, up to 250C, the operation
temperature range of silicon CMOS and BiCMOS standard technologies, by means of integrated circuit design techniques (no process modifications are added, to keep the low-cost feature). The experiments were done using a commercial CMOS and BiCMOS technology; the obtained results could be employed with any similar technology. In addition, the high temperature performance seems to ameliorate in future technologies, since the density increase involves a doping concentration increase and the reduction of the isolation junctions' dimensions.
Two industrial applications, which are good examples of the potential market for high temperature applications, helped to experimentally verify the obtained theoretical results.
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Submitted on : Thursday, February 9, 2006 - 5:02:58 PM
Last modification on : Thursday, November 19, 2020 - 3:56:19 PM
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  • HAL Id : tel-00011575, version 1

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R.A. Bianchi. Techniques de conception des circuits intégrés analogiques pour des applications en haute température, en technologies de conception des circuits intégrés analogiques pour des applications en haute température, en technologies sur substrat de silicium. Micro et nanotechnologies/Microélectronique. Institut National Polytechnique de Grenoble - INPG, 1999. Français. ⟨tel-00011575⟩

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