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Brasure composite sans plomb de la conception à la caractérisation

Abstract : The development of new adaptive lead-free composite solder has been prompted by the growing awareness of environmental concerns and the necessity to increase reliability. In that way micronic NiTi shape memory alloy particles have been incorporated in a Sn-3.8Ag-0.7Cu matrix in order to develop composite solder. Microstructural and mechanical characterisation of the lead-free matrix have been performed. An homogeneous copper coating is chemically applied onto NiTi particles in order to improve the wettability between the reinforcement and the lead-free matrix. Chemical and microstructural analysis of the NiTi particles surface during the different steps of the coating process have been performed. Finally thermomechanical fatigue properties have been assessed to show the influence of the shape memory alloy reinforcement.
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Contributor : Stéphane Toulin <>
Submitted on : Monday, September 19, 2005 - 5:38:58 PM
Last modification on : Saturday, March 30, 2019 - 1:39:00 AM
Long-term archiving on: : Friday, April 2, 2010 - 10:11:40 PM


  • HAL Id : tel-00010206, version 1



Olivier Fouassier. Brasure composite sans plomb de la conception à la caractérisation. Matériaux. Université Sciences et Technologies - Bordeaux I, 2001. Français. ⟨tel-00010206⟩



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