G. Binnig, AFM) a ´ eté développé initialement par afin de visualiser des surfacesàsurfacesà l'´ echelle atomique. 5.1 Motivations, Microscopè a force atomique 4.1.1 Fonctionnement Le microscopè a force atomique Diminution de la surface de contact et des forces d'adhésion . . . . 72 5.1.2 Contraintes technologiques . . . . . . . . . . . . . . . . . . . . . . . 72

Z. Rymuza, Control tribological and mechanical properties of mems surfaces. part 1 : critical rewiew. Microsystem Technologies, pp.173-180, 1999.

A. Tuantranont, V. M. Bright, L. A. Liew, W. Zhang, and Y. C. Lee, Smart phase-only micromirror array fabricated by standard CMOS process, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308), pp.455-460, 2000.
DOI : 10.1109/MEMSYS.2000.838560

R. Sawada, E. Higurashi, and T. Ito, Integrated microlaser displacement sensor, Journal of Micromechanics and Microengineering, vol.12, issue.3, pp.286-290, 2002.
DOI : 10.1088/0960-1317/12/3/314

M. Gad and . Hak, The MEMS Handbook, 2002.

S. A. Tadigadapa and N. Najafi, Developments in Microelectromechanical Systems (MEMS): A Manufacturing Perspective, Journal of Manufacturing Science and Engineering, vol.125, issue.4, pp.816-823, 2003.
DOI : 10.1115/1.1617286

S. Raud, Microsystèmes : Les derniéres initiatives universitaires auxétatsauxétats-Unis Ambassade de France auxÉtatsaux´auxÉtats-Unis. Mission pour la science et la technologie, Consulat Général de

T. Ebefors, Polyimide V-Groove joints for three-dimensional silicon transducers -exemplified through a 3-D turbulent gas flow sensor and micro-robotic devices, Computer Science -Electrical Engineering -Engineering Physics (DEF) Royal Institute of Technology (KTH), 2000.

F. Ayazi and K. Najafi, High aspect-ratio combined poly and single-crystal silicon (HARPSS) MEMS technology, Journal of Microelectromechanical Systems, vol.9, issue.3, pp.288-294, 2000.
DOI : 10.1109/84.870053

T. Whitted, Designing and fabricating MEMS devices. research.microsoft.com/ hardware, 1998.

D. A. Koester, R. Mahadevan, B. Hardy, and K. W. Markus, MUMPs Design Handbook. Cronos Integrated Microsystems, 2001.

T. Abe and M. L. Reed, Control of liquid bridging induced stiction of micromechanical structures, Journal of Micromechanics and Microengineering, vol.6, issue.2, pp.213-216, 1996.
DOI : 10.1088/0960-1317/6/2/002

Y. H. Jang and Y. K. Kim, Design, fabrication and characterization of an electromagnetically actuated addressable out-of-plane micromirror array for vertical optical source applications, Journal of Micromechanics and Microengineering, vol.13, issue.6, pp.853-863, 2003.
DOI : 10.1088/0960-1317/13/6/308

K. Fushinobu, L. M. Phinney, Y. Kurosaki, and C. L. Tien, Optimization of laser parameters for ultrashort-pulse laser recovery of stiction-failed microstructures, Numerical Heat Transfer, Part A (Applications), vol.26, issue.4, pp.345-357, 1999.

V. Kaajakari and A. Lal, Pulsed ultrasonic release and assembly micromachines, The 10th Conference on Solid-State Sensors and Actuators, pp.212-215, 1999.

S. A. Henck, Lubrification of digital micromirror devices, Tribology Letters, vol.3, issue.3, pp.239-247, 1997.
DOI : 10.1023/A:1019129021492

C. H. Mastrangelo, Suppression of Stiction in MEMS, MRS Proceedings, vol.518, 1999.
DOI : 10.1109/MEMSYS.1993.296955

A. W. Adamson and A. P. Cast, Physical Chemistry of Surfaces, Journal of The Electrochemical Society, vol.124, issue.5, 1997.
DOI : 10.1149/1.2133374

M. P. De-boer, J. A. Knapp, J. M. Redmond, and T. A. Michalske, Adhesion, adhesion hysteresis and friction in MEMS under controlled humidity ambients, Symposium on Microscale Mechanics of Materials and Structures. ASME IMECE conference, 1998.

E. Buks and M. L. Roukes, Stiction, adhesion energy, and the Casimir effect in micromechanical systems, Physical Review B, vol.63, issue.3, pp.33402-33403, 2001.
DOI : 10.1103/PhysRevB.63.033402

E. Buks and M. L. Roukes, Metastability and the Casimir effect in micromechanical systems, Europhysics Letters (EPL), vol.54, issue.2, p.220226, 2001.
DOI : 10.1209/epl/i2001-00298-x

R. Maboudian, W. R. Ashurst, and C. Carraro, Tribological challenges in micromechanical systems, Tribology Letters, vol.12, issue.2, pp.95-100, 2002.
DOI : 10.1023/A:1014044207344

W. M. Van-spengen, R. Puers, and I. Wolf, A physical model to predict stiction in MEMS, Journal of Micromechanics and Microengineering, vol.16, issue.1, pp.702-713, 2002.
DOI : 10.1088/0960-1317/16/1/C01

C. H. Mastrangelo, Adhesion-related failure mechanisms in micromechanical devices, Tribology Letters, vol.3, issue.3, pp.223-238, 1997.
DOI : 10.1023/A:1019133222401

C. H. Mastrangelo and C. H. Hsu, Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theory, Journal of Microelectromechanical Systems, vol.2, issue.1, pp.33-4344, 1993.
DOI : 10.1109/84.232593

Y. Yee, M. Park, and K. Chun, A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperature, Journal of Microelectromechanical Systems, vol.7, issue.3, pp.339-344, 1998.

F. Restagno, Interactions entre contacts solides et cinétique de la condensation capillaire. Aspects macroscopiques et aspects microscopiques, 2000.

M. P. De-boer, P. J. Clews, P. K. Smith, and T. A. Michalske, Adhesion of polysilicon beams in controlled humidity ambients, Microelectromechanical Structures for Materials Research Symposium, pp.131-136, 1998.

U. Srinivasan, D. Liepmann, and R. T. Howe, Microstructure to substrate self-assembly using capillary forces, Journal of Microelectromechanical Systems, vol.10, issue.1, pp.17-24, 2001.
DOI : 10.1109/84.911087

J. Israëlachvili, Intermolecular and surface forces, 1992.

K. E. Cooper, A fundamental and experimental study into the adhesion of micron-scale particles to thin films, 2000.

N. Gane, P. F. Pfaelzer, and D. Tabor, Adhesion between Clean Surfaces at Light Loads, Proceedings oft he Royal Society of London, pp.495-517, 1623.
DOI : 10.1098/rspa.1974.0167

S. Bhattacharjee, C. H. Ko, and M. Elimelech, DLVO Interaction between Rough Surfaces, Langmuir, vol.14, issue.12, pp.3365-3375, 1998.
DOI : 10.1021/la971360b

R. W. Carpick, D. F. Ogletree, and M. Salmeron, A General Equation for Fitting Contact Area and Friction vs Load Measurements, Journal of Colloid and Interface Science, vol.211, issue.2, pp.395-400, 1999.
DOI : 10.1006/jcis.1998.6027

B. Bhushan, Handbook of micro-nano tribology, CRC, 1999.

F. Restagno and J. Crassous, Adhesion between weakly rough beads, Physical Review E, vol.65, issue.4, pp.1-4, 2002.
DOI : 10.1103/PhysRevE.65.042301

C. Cottin-bizonne, S. Jurine, J. Baudry, J. Crassous, F. Restagno et al., Nanorheology : An investigation of the boundary condition at hydrophobic and hydrophilic interfaces, The European Physical Journal E, vol.9, pp.47-53, 2002.

K. L. Johnson, Contact Mechanics, 1985.

B. V. Derjaguin, Untersuchungen ??ber die Reibung und Adh??sion, IV, Kolloid-Zeitschrift, vol.69, issue.2, pp.155-164, 1934.
DOI : 10.1007/BF01433225

J. M. Bustillo, R. T. Howe, and R. S. Muller, Surface micromachining for microelectromechanical systems, IEEE Proceedings of the IEEE, pp.1552-1574, 1998.
DOI : 10.1109/5.704260

B. Okolo, P. Lamparter, U. Welzel, and E. J. Mittemeijer, Stress, texture, and microstructure in niobium thin films sputter deposited onto amorphous substrates, Journal of Applied Physics, vol.95, issue.2, pp.466-476, 2004.
DOI : 10.1063/1.1631733

H. Windischmann, Intrinsic stress in sputter-deposited thin films, Critical Reviews in Solid State and Materials Sciences, vol.6, issue.6, pp.547-596, 1992.
DOI : 10.1116/1.1316268

J. A. Thornton and D. W. Hoffman, Internal stresses in titanium, nickel, molybdenum, and tantalum films deposited by cylindrical magnetron sputtering, Journal of Vacuum Science and Technology, vol.14, issue.1, pp.164-168, 1977.
DOI : 10.1116/1.569113

H. Windischmann, An intrinsic stress scaling law for polycrystalline thin films prepared by ion beam sputtering, Journal of Applied Physics, vol.62, issue.5, pp.1800-1807, 1987.
DOI : 10.1063/1.339560

K. H. Muller, Stress and microstructure of sputter???deposited thin films: Molecular dynamics investigations, Journal of Applied Physics, vol.62, issue.5, pp.1796-1799, 1987.
DOI : 10.1063/1.339559

R. Howe and T. Srinivasan, Introduction to MEMS design -lecture 6 mechanics of materials. www-bsac.eecs.berkeley, Lecture6.MEMS.Materials.pdf, 2003.

A. Tarraf, J. Daleiden, S. Irmer, D. Prasai, and H. Hillmer, Stress investigation of PECVD dielectric layers for advanced optical MEMS, Journal of Micromechanics and Microengineering, vol.14, issue.3, pp.317-323, 2004.
DOI : 10.1088/0960-1317/14/3/001

R. P. Dahiya and V. K. Mathur, Space-charge-limited currents in insulators under illumination, Journal of Physics D: Applied Physics, vol.7, issue.11, pp.1512-1517, 1974.
DOI : 10.1088/0022-3727/7/11/312

K. A. Peterson, P. Tangyunyong, and A. A. Pimentel, Failure analysis of surface-micromachined microengines, Materials and Device Characterization in Micromachining, pp.190-200, 1998.
DOI : 10.1117/12.324056

N. Tas, T. Sonnenberg, H. Jansen, and R. Legtenberg, Stiction in surface micromachining, Journal of Micromechanics and Microengineering, vol.6, issue.4, pp.385-397, 1996.
DOI : 10.1088/0960-1317/6/4/005

M. Houston, Surface treatments for adhesion reduction in polysilicon micromechanical devices, 1996.

B. Bhushan, Adhesion and stiction: Mechanisms, measurement techniques, and methods for reduction, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.21, issue.6, pp.2262-2296, 2003.
DOI : 10.1116/1.1627336

M. J. Lin and R. Chen, Adhesion criterion of center-anchored circulate plates in microstructures . Sensors and Actuators -A A simple experimental technique for the measurement of the work of adhesion of microstructure, International Workshop on Solid-State Sensors and Actuator (Hilton Head'92), pp.14-23, 1992.

J. M. Gere and S. P. Timoshenko, MEchanics of materials, 1984.
DOI : 10.1007/978-1-4899-3124-5

C. Gui, M. Elwenspoek, N. Tas, and J. G. Gardenier, The surface adhesion parameter: a measure for wafer bondability, Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291), pp.290-295, 1999.
DOI : 10.1109/MEMSYS.1999.746839

C. Gui, M. Elwenspoek, N. Tas, and J. G. Gardeniers, The effect of surface roughness on direct wafer bonding, Journal of Applied Physics, vol.85, issue.10, p.85, 1999.
DOI : 10.1063/1.369377

W. Yan and K. Komvopoulos, Contact analysis of elastic-plastic fractal surfaces, Journal of Applied Physics, vol.84, issue.7, pp.3437-4024, 1998.
DOI : 10.1063/1.368536

B. Bhushan, Nanoscale tribophysics and tribomechanics, Wear, vol.225, issue.229, pp.225465-492, 1999.
DOI : 10.1016/S0043-1648(99)00018-6

N. R. Tas, C. Gui, and M. Ewenspoek, Static friction in elastic adhesive MEMS. contacts, modes and experiment, Thirtheenth IEEE International Micro Electro Mechanical systems Conference, pp.1993-1998, 2000.

G. Palasantzas, J. M. Th, and . De-hosson, Influence of surface roughness on the adhesion of elastic films, Physical Review E, vol.67, issue.2, pp.1-6, 2003.
DOI : 10.1103/PhysRevE.67.021604

B. N. Persson, Elastoplastic Contact between Randomly Rough Surfaces, Physical Review Letters, vol.87, issue.11, pp.1-4, 2001.
DOI : 10.1103/PhysRevLett.87.116101
URL : http://juser.fz-juelich.de/record/42963/files/6008.pdf

G. Palasantzas, Contact area calculation between elastic solids bounded by mound rough surfaces, Solid State Communications, vol.125, issue.11-12, pp.611-615, 2003.
DOI : 10.1016/S0038-1098(03)00009-7

F. M. Borodich, Comment on ???Elastoplastic Contact between Randomly Rough Surfaces???, Physical Review Letters, vol.88, issue.6, 2002.
DOI : 10.1103/PhysRevLett.88.069601

S. Deladi, G. Krijnen, N. Tas, and M. Elwenspoek, Three dimensional adhesion model for arbitrary rough surfaces, Nanotech, editor, Technical Proceedings of the 2002 International Conference on Computational Nanoscience and Nanotechnology, pp.326-339, 2002.

G. Palasantzas, Roughness spectrum and surface width of self-affine fractal surfaces via the K-correlation model, Physical Review B, vol.48, issue.19, pp.14472-14478, 1993.
DOI : 10.1103/PhysRevB.48.14472

A. I. Sviridenok, A. A. Chizhik, and I. F. Sveklo, Microtribological problems of physics and mechanics in smooth surface contact, Tribology International, vol.29, issue.5, pp.377-384, 1996.
DOI : 10.1016/0301-679X(95)00067-E

F. Restagno, J. Crassous, C. Cottin-bizonne, and E. Charlaix, Adhesion between weakly rough beads, Physical Review E, vol.65, issue.4, pp.1-4, 2002.
DOI : 10.1103/PhysRevE.65.042301

B. N. Persson, F. Bucher, and B. Chiaia, Elastic contact between randomly rough surfaces: Comparison of theory with numerical results, Physical Review B, vol.65, issue.18, pp.1-7, 2002.
DOI : 10.1103/PhysRevB.65.184106

G. Palasantzas, Contact area calculation between elastic solids bounded by mound rough surfaces. Solid State Communication, pp.611-615, 2003.
DOI : 10.1016/s0038-1098(03)00009-7

M. He, A. Szuchmacher-blum, D. E. Aston, C. Buenviaje, R. M. Overney et al., Critical phenomena of water bridges in nanoasperity contacts, The Journal of Chemical Physics, vol.114, issue.3, pp.1355-1360, 2001.
DOI : 10.1063/1.1331298

L. Sirghi, Effect of capillary-condensed water on the dynamic friction force at nanoasperity contacts, Applied Physics Letters, vol.82, issue.21, pp.3587-3793, 2003.
DOI : 10.1063/1.1572533

S. Sundararajan and B. Bhushan, Static friction and surface roughness studies of surface micromachined electrostatic micromotors using an atomic force/friction force microscope, Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol.19, issue.4, pp.1777-1785, 2001.
DOI : 10.1116/1.1353539

M. P. De-boer, J. A. Knapp, and P. J. Clews, Effect of nonotexturing on interfacial adhesion in MEMS, International Conference on Fracture, 2001.

S. C. Lee, Significance of Adhesion Forces and a Means to Reduce Adhesion in Ultra-Low Flying Head Disk Interfaces of Magnetic Storage Hard Disk Drives, 2002.

N. Miki and S. M. Spearing, Effect of nanoscale surface roughness on the bonding energy of direct-bonded silicon wafers, Journal of Applied Physics, vol.94, issue.10, pp.6800-6806, 2003.
DOI : 10.1063/1.1621086

H. Moriceau, O. Rayssac, B. Aspar, and B. Ghyselen, The bondig energy control : an original way to debondable substrates, ECS, editor, Proceeding of the 203rd meeting of the electrochemical society M1 -The seventh International Syposium on Semiconductor Wafer Bonding Science, Technology, and Applications, p.999, 2003.

C. Cottin-bizonne, J. L. Barrat, E. Charlaix, and L. Bocquet, Low friction flows of liquids at nanopatterned interfaces. arXiv :cond-mat, 2003.
URL : https://hal.archives-ouvertes.fr/hal-00000275

F. Tardif, A. Danel, and O. Raccurt, Understanding of wet and alternative particle removal processes in microelectronics : theoretical capabilities and limitations, 6th Symposium Diagnostics and Yield : Advanced Silicon Devices and Technologies for ULSI Era, 2003.

J. Y. Walz and N. Sun, Effects of surface roughness on van der Waals and electrostatic contributions to particle-particle interaction and particle adhesion, of Particles on Surfaces, pp.151-169, 2002.

R. L. Alley, P. Mai, K. Komvopulos, and R. T. Howe, Surface roughness modification of interfacial contacts in polysilicon microstructures, Transducers 93, pp.288-291, 1993.

Y. Yee, K. Chun, and J. D. Lee, Polysilicon surface-modification technique to reduce sticking of microstructures, Transducer' 95, pp.206-209, 1995.
DOI : 10.1016/0924-4247(96)80140-3

C. C. Lee and W. Hsu, Modification on surface roughness by combining dry and wet etching Surface texturing and chemical treatment methods for reducing high adhesion forces at micromachine interfaces, SPIE Proceedings of the international society for optical engineering SPIE Proceedings of the international society for optical engineering, pp.627-635, 1998.

N. Fujitsuka and J. Sakata, A new technique to prevent stiction using silicon selective etching for SOI-MEMS. Sensors and Actuators, A-97-98, pp.716-719, 2002.

D. R. Lide, Handbook of Chemistry and Physics, 1991.

J. Lee, H. Moon, J. Fowler, T. Schoellhammer, and C. J. Kim, Electrowetting and electrowetting-on-dielectric for microscale liquid handling, Sensors and Actuators A: Physical, vol.95, issue.2-3, pp.259-268, 2002.
DOI : 10.1016/S0924-4247(01)00734-8

C. J. Kim, A note on stiction in MEMS, 2001.

C. J. Kim, J. Y. Kim, and B. Sridharan, Comparative evaluation of drying techniques for surface-micromachining. Sensors and Actuators, pp.6417-6443, 1998.

T. S. Sammarco and M. A. Burns, Heat-transfer analysis of microfabricated thermocapillary pumping and reaction devices, Journal of Micromechanics and Microengineering, vol.10, issue.1, pp.42-55, 2000.
DOI : 10.1088/0960-1317/10/1/307

G. Lumia, Utilisation du CO2 supercritique comme solvant de substitution, pp.1-6, 2002.

Y. Fukushima, Application of supercritical fluids, R&D Review of Toyota CRDL, vol.35, issue.1, pp.1-9, 1999.

G. T. Mulhern, D. S. Soane, and R. T. Howe, Supercritical carbone dioxide drying of microstructures, International Conférence of Solid-State Sensors and Actuators, pp.296-299, 1993.

C. Liang, G. Sha, and S. Guo, Resorcinol???formaldehyde aerogels prepared by supercritical acetone drying, Journal of Non-Crystalline Solids, vol.271, issue.1-2, pp.167-170, 2000.
DOI : 10.1016/S0022-3093(00)00108-3

. St, R. Frohnhoff, T. Arens-fischer, J. Heinrich, M. Fricke et al., Characterization of supercritically dried porous silicon, Thin Solid Films, vol.255, pp.115-118, 1995.

G. W. Scherer, Recent progress in drying of gels, Journal of Non-Crystalline Solids, vol.147, issue.148, pp.363-374, 1992.
DOI : 10.1016/S0022-3093(05)80645-3

G. W. Scherer, Stress development during supercritical drying, Journal of Non-Crystalline Solids, vol.145, pp.33-40, 1992.
DOI : 10.1016/S0022-3093(05)80425-9

L. T. Canham, A. G. Cullis, C. Pickering, O. D. Dosser, T. I. Cox et al., Luminescent anodized silicon aerocrystal networks prepared by supercritical drying, Nature, vol.63, issue.6467, pp.133-135, 1994.
DOI : 10.1038/368133a0

U. Grüing and A. Yelon, Capillary and Van der Waals forces and mechanical stability of porous silicon, Thin Solid Films, vol.255, issue.1-2, pp.135-138, 1995.
DOI : 10.1016/0040-6090(94)05638-T

G. Amato, V. Bullara, N. Brunetto, and L. Boarino, Drying of porous silicon: a Raman, electron microscopy, and photoluminescence study, Thin Solid Films, vol.276, issue.1-2, pp.204-207, 1996.
DOI : 10.1016/0040-6090(95)08053-8

O. Belmont and D. Bellet, + type silicon during drying, Journal of Applied Physics, vol.79, issue.10, pp.7586-7591, 1996.
DOI : 10.1063/1.362415

C. W. Dyck, J. H. Smith, S. L. Miller, E. M. Russick, and C. L. Adkins, Supercritical carbon dioxide solvent extraction from surface-micromachined micromechanical structures, The international Society for Optical Engineering SPIE Micromachining and Microfabrication, pp.225-235, 1996.
DOI : 10.2172/378809
URL : https://digital.library.unt.edu/ark:/67531/metadc684547/m2/1/high_res_d/378809.pdf

H. Namatsu, Supercritical drying for water-rinsed resist systems, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.18, issue.6, pp.3308-3312, 2000.
DOI : 10.1116/1.1313583

R. Maboudian, Surface processes in MEMS technology, Surface Science Reports, vol.30, issue.6-8, pp.207-269, 1998.
DOI : 10.1016/S0167-5729(97)00014-9

D. L. Gooldfarb, J. J. De-pablo, and P. F. Nealey, Aqueous-based photoresist drying using supercritical carbon dioxide to prevent pattern collapse, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.18, issue.6, pp.3313-3317, 2000.
DOI : 10.1116/1.1313582

H. Namatsu, K. Yamazaki, and K. Kurihara, Supercritical resist dryer, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.18, issue.2, pp.780-784, 2000.
DOI : 10.1116/1.591276

H. Namatsu, Supercritical resist drying for isolated nanoline formation, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.19, issue.6, pp.2709-2712, 2001.
DOI : 10.1116/1.1418411

H. Namatsu, K. Yamazaki, and K. Kurihara, Supercritical drying for nanostructure fabrication without pattern collapse, Microelectronic Engineering, vol.46, issue.1-4, pp.129-132, 1999.
DOI : 10.1016/S0167-9317(99)00033-7

S. B. Williamas, K. E. Laintz, J. C. Barton, and W. D. Spall, Elimination of solvents and waste by using supercritical carbon dioxide in precision cleaning, 1994.

L. Pavesi and V. Mulloni, Porous silicon, Proceedings of the International School of Physics " E. Fermi " , volume Course XCLI, 1999.

G. Amato and N. Brunetto, Porous silicon via freeze drying, Materials Letters, vol.26, issue.6, pp.295-298, 1996.
DOI : 10.1016/0167-577X(95)00244-8

P. Monaghan, N. Perusinghe, and M. Müller, High-pressure freezing for immunocytochemistry, Journal of Microscopy, vol.192, issue.3, pp.248-258, 1998.
DOI : 10.1046/j.1365-2818.1998.00387.x

H. Louis, J. Lavie, P. Lacolley, D. Daret, J. Bonnet et al., Freeze-drying Allows Double Nonradioactive ISH and Antigenic Labeling, Journal of Histochemistry & Cytochemistry, vol.48, issue.4, pp.499-507, 2000.
DOI : 10.1177/002215540004800408

H. Stein, K. Gatter, H. Asbahr, and D. Y. Mason, Use of freeze-dried paraffin-embedded sections for immunohistologic staining with monoclonal antibodies Freeze-dried paraffin-embedded human tissue for antigen labelling with monoclonal antibodies, Lab Invest Lancet, issue.522, pp.676-68371, 1984.

P. Meredith, A. M. Donald, and R. S. Payne, Freeze-Drying: In Situ Observations Using Cryoenvironmental Scanning Electron Microscopy and Differential Scanning Calorimetry, Journal of Pharmaceutical Sciences, vol.85, issue.6, pp.631-637, 1996.
DOI : 10.1021/js950324z

F. Pillì-ere, J. C. Protois, and M. Reynier, 1,4-dichlorobenzène -fiche toxicologique N ? 23, pp.106-152, 1993.

J. Bhardwaj, H. Ashraf, and A. Mc-quarrie, Dry silicon etching for MEMS, Symposium on Microstructures and Microfabricated Systems, Annual Meeting of the Electrochemical Society, pp.1-13, 1997.

K. Shimaoka and J. Sakata, A new full-dry processing method for MEMS, R&D Review of Toyota CRDL, vol.37, issue.3, pp.59-66, 2002.

R. Kassing and I. W. Rangelow, Etching process for high aspect ratio micro systems technology (HARMST). Microsystem Technologies, pp.20-27, 1996.

S. Kuiper, M. De-boer, C. Van-rijn, W. Nijdam, G. Krijnen et al., Wet and dry etching techniques for the release of sub-micrometre perforated membranes, Journal of Micromechanics and Microengineering, vol.10, issue.2, pp.171-174, 2000.
DOI : 10.1088/0960-1317/10/2/312

W. I. Jang, C. A. Choi, M. L. Lee, C. H. Jun, and Y. T. Kim, Fabrication of MEMS devices by using anhydrous HF gas-phase etching with alcoholic vapor, Journal of Micromechanics and Microengineering, vol.12, issue.3, pp.297-306, 2002.
DOI : 10.1088/0960-1317/12/3/316

K. R. Williams and R. S. Muller, Etch rates for micromachining processing, Journal of Microelectromechanical Systems, vol.5, issue.4, pp.256-269, 1996.
DOI : 10.1109/84.546406

A. Witvrouw, B. Du-bois, P. De-moor, A. Verbist, C. Van-hoof et al., <title>Comparison between wet HF etching and vapor HF etching for sacrificial oxide removal</title>, Micromachining and Microfabrication Process Technology VI, pp.130-141, 2000.
DOI : 10.1117/12.396423

D. S. Becker and J. W. Butterbaugh, Formation of nano-structures through sacrificial oxyde etching. In Advanced surface preparation leading in to the nano-area -Semicon Europea, pp.1-6, 2003.

G. Vereecke, M. Schaekers, K. Verstraete, S. Arnauts, M. M. Heyns et al., Quantitative Analysis of Trace Metals in Silicon Nitride Films by a Vapor Phase Decomposition/Solution Collection Approach, Journal of The Electrochemical Society, vol.147, issue.4, pp.1499-1501, 2000.
DOI : 10.1149/1.1393385

N. Tas, M. Elwenspoek, and R. Legtenberg, Side-wall spacers for stiction reduction in surface micromachined mechanisms, Proceedings of Micromechanics Workshop (MME '96), pp.92-95, 1996.

L. S. Fan, Integrated micromachinery -Moving Structures in Silicon Chips, 1990.

W. C. Tang, T. C. Nguyen, and R. T. Howe, Laterally driven polysilicon resonant microstructures, IEEE Proceeding of IEEE Micro Electro Mechanical Systems Workshop, p.5359, 1989.
DOI : 10.1109/memsys.1989.77961

L. L. Mercado, S. M. Kuo, T. Y. Lee, and L. Liu, A mechanical approach to overcome rf mems switch stiction problem, IEEE Electronic Components and Technology Conference, pp.377-384, 2003.

G. Lin, R. A. Lawton, J. Wellman, and L. Phinney, Minimum dimension dimple analysis, 2000.

M. C. Wu, Case study 2 : Digital Micromirror Devices (DMD). www.ee.ucla, 2001.

C. H. Mastrangelo and G. Saloka, A dry-release method based on polymer columns for microstructure fabrication, [1993] Proceedings IEEE Micro Electro Mechanical Systems, p.7781, 1993.
DOI : 10.1109/MEMSYS.1993.296955

G. T. Kovacs, N. I. Maluf, and K. E. Peterson, Bulk micromachining of silicon, Proceedins of the IEEE, pp.1536-1551, 1998.
DOI : 10.1109/5.704259

S. Sundararajan and B. Bhushan, Micro/nanotribological studies of polysilicon and SiC films for MEMS applications, Wear, vol.217, issue.2, pp.251-261, 1998.
DOI : 10.1016/S0043-1648(98)00169-0

Y. Matsumoto, T. Shimada, and M. Ishida, Novel prevention method of stiction using silicon anodization for SOI structure. Sensors and Actuators -A, pp.153-159, 1999.

H. Muraoka, T. Ohashi, and Y. Sumitomo, Controlled preferential etching technology, Journal of The Electrochemical Society, vol.120, issue.3, p.96, 1973.

S. Pamidighantam, W. Laureyn, C. Rusu, K. Baert, R. Puers et al., A wet release process for fabricating slender and compliant suspended micro-mechanical structures . Sensors and Actuators -A, pp.202-212, 2003.

U. Srinivasan, M. R. Houston, R. T. Howe, and R. Maboudian, Alkyltrichlorosilane-based self-assembled monolayer films for stiction reduction in silicon micromachines, Journal of Microelectromechanical Systems, vol.7, issue.2, pp.252-260, 1998.
DOI : 10.1109/84.679393

W. R. Ashurst, C. Yau, C. Carraro, C. Lee, G. J. Kluth et al., Alkene based monolayer films as anti-stiction coatings for polysilicon MEMS. Sensors and Actuators A The impact of solution aglomeration on deposition of self-assembled monolayer, Langmuir, vol.91, issue.16, pp.238-2487742, 2000.

W. R. Ashurt, C. Yau, C. Carraro, R. Maboudian, and M. T. Dugger, Dichlorodimethylsilane as an anti-stiction monolayer for MEMS: a comparison to the octadecyltrichlorosilane self-assembled monolayer, Journal of Microelectromechanical Systems, vol.10, issue.1, pp.41-49, 2001.
DOI : 10.1109/84.911090

B. H. Kim, C. H. Oh, K. Chun, T. D. Chung, J. W. Byun et al., A new class of surface modifiers for stiction reduction, IEEE Proceedings of the 12th IEEE International Conferece on Micro Electro Mechanical Systems (MEMS99), pp.189-193, 1999.

B. H. Kim, T. D. Chung, C. H. Oh, and K. Chun, A new organic modifier for anti-stiction, Journal of Microelectromechanical Systems, vol.10, issue.1, pp.33-40, 2001.

B. J. Kim, G. M. Kim, M. Liebau, J. Huskens, D. N. Reinhout et al., "SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090), pp.106-109, 2001.
DOI : 10.1109/MEMSYS.2001.906490

A. M. Almanza-workman, S. Raghavan, P. Deymier, D. J. Monk, and R. Roop, Water Dispersible Silanes for Wettability Modification of Polysilicon, Journal of The Electrochemical Society, vol.149, issue.1, pp.6-11, 2002.
DOI : 10.1149/1.1423645

U. Srinivasan, R. T. Howe, and D. Liepmann, Fluidic microsassembly using patterned self-assembled monolayers and shape matching, International Conference on Solid- State Sensors and Actuators, pp.1170-1173, 1999.

J. Jr, E. H. Gau, B. Lan, C. M. Dunn, J. C. Ho et al., A MEMS based amperometric detector for E. Coli bacteria using self-assembled monolayers, Biosensors & Bioelectronics, vol.16, pp.745-755, 2000.

C. D. Bain, E. B. Troughton, Y. T. Tao, J. Evall, G. M. Whitesides et al., Formation of monolayer films by the spontaneous assembly of organic thiols from solution onto gold, Journal of American Chemical Society, vol.111, p.81, 1989.

J. Xie, X. Yang, X. Q. Wang, and Y. C. Tai, Surface micromachioned leakage proof parylene check valve, Technical Digest of the 14th IEEE International Conference on MicroElectroMechanical Systems, pp.539-542, 2001.

J. M. Kim, C. W. Baek, J. H. Park, D. S. Shin, Y. S. Lee et al., Continuous anti-stiction coatings using self-assembled monolayers for gold microstructures, Journal of Micromechanics and Microengineering, vol.12, issue.5, pp.688-695, 2002.
DOI : 10.1088/0960-1317/12/5/327

R. Maboudian, W. R. Ashurst, and C. Carraro, Self-assembled monolayers as anti-stiction coating for MEMS : Characteristics and recent developments. Sensors and Actuators, A-82, pp.219-223, 2000.

R. S. Muller, M. Albin, P. W. Barth, S. B. Crary, D. D. Denton et al., Microelectromechanical Systems Advanced Materials and Fabrication Methods

S. Kim, G. Y. Choi, A. Ulman, and C. Fleischer, Effect of Chemical Functionality on Adhesion Hysteresis, Langmuir, vol.13, issue.25, pp.6850-6856, 1997.
DOI : 10.1021/la970649q

W. R. Ashurst, C. Carraro, and R. Maboudian, Vapor phase anti-stiction coatings for MEMS, IEEE IEEE Transactions on device and materials reliability, pp.173-178, 2003.
DOI : 10.1109/TDMR.2003.821540

W. R. Ashurst, C. Carraro, R. Maboudian, and W. Frey, Wafer level anti-stiction coatings with superior thermal stability, Proceedings of Solid-State Sensor, Actuator and Microsystems Workshop, pp.142-145, 2002.

A. Hozumi, K. Ushiyama, H. Sugimura, and O. Takai, Fluoroalkylsilane Monolayers Formed by Chemical Vapor Surface Modification on Hydroxylated Oxide Surfaces, Langmuir, vol.15, issue.22, pp.7600-7604, 1999.
DOI : 10.1021/la9809067

W. R. Ashurst, Surface engineering for MEMS reliability, 2003.

T. M. Mayer, M. P. Boer, N. D. Shinn, P. J. Clews, and T. A. Michalske, Chemical vapor deposition of fluoroalkylsilane monolayer films for adhesion control in microelectromechanical systems, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.18, issue.5, pp.2433-2440, 2000.
DOI : 10.1116/1.1288200

N. D. Hoivik, J. W. Elam, R. J. Linderman, V. M. Bright, S. M. George et al., Atomic layer deposited protective coatings for micro-electromechanical systems, Sensors and Actuators A: Physical, vol.103, issue.1-2, pp.100-108, 2003.
DOI : 10.1016/S0924-4247(02)00319-9

R. H. Wieringa, Surface-Grafted Polyglutamate Films with Reaction-Induced Polar Order, 2000.

G. Binnig, C. F. Quate, and C. Gerber, Atomic Force Microscope, Physical Review Letters, vol.56, issue.9, pp.930-933, 1986.
DOI : 10.1103/PhysRevLett.56.930

G. Binnig, C. Gerber, E. Stoll, T. R. Albrecht, and C. F. Quate, Atomic Resolution with Atomic Force Microscope, Europhysics Letters (EPL), vol.3, issue.12, pp.1281-1286, 1987.
DOI : 10.1209/0295-5075/3/12/006

R. Marcus, T. Ravi, T. Gmitter, K. Chin, D. Liu et al., Formation of silicon tips with <1 nm radius, Applied Physics Letters, vol.56, issue.3, pp.236-238, 1990.
DOI : 10.1063/1.102841

. Veeco, T. Multimode, . Spm-instruction, and . Manual, Digital Instruments Veeco Metrology Group, version 4, 174] Veeco. NanoScope Command Reference Manual. Digital Instruments Veeco Metrology Group, 1997.

M. S. Bischel, M. R. Van-landingham, R. F. Eduljee, J. W. Gillespie-jr, and J. M. Schultz, On the use of nanoscale indentation with the AFM in the identification of phases in blends of linear low density polyethylene and high density polyethylene, Journal of Materials Science, vol.35, issue.1, pp.221-228, 2000.
DOI : 10.1023/A:1004781725300

L. H. Segeren, F. G. Karssenberg, J. P. Pickering, J. W. Van-den, G. J. Berg et al., Adhesion measurements by AFM and surface enerrgy characteristics by IGC of xerographic toner particles under different mechanical and environmental conditions, Particles on Surfaces : Detection, Adhesion and Removal, pp.197-217, 2002.

E. Beach, J. Drelich, and R. Han, Measurements of adhesion forces in pharmaceutical powder-polymer systms by atomic force microscopy, Particles on Surfaces : Detection, Adhesion and Removal, pp.219-234, 2002.

K. M. Andersson and L. Bergström, DLVO Interactions of Tungsten Oxide and Cobalt Oxide Surfaces Measured with the Colloidal Probe Technique, Journal of Colloid and Interface Science, vol.246, issue.2, pp.309-315, 2002.
DOI : 10.1006/jcis.2001.8021

R. B. Best, B. Li, A. Steward, V. Daggett, and J. Clarke, Can Non-Mechanical Proteins Withstand Force? Stretching Barnase by Atomic Force Microscopy and Molecular Dynamics Simulation, Biophysical Journal, vol.81, issue.4, pp.2344-2356, 2001.
DOI : 10.1016/S0006-3495(01)75881-X
URL : http://doi.org/10.1016/s0006-3495(01)75881-x

V. V. Zavyalov, J. S. Mcmurray, S. D. Stirling, C. C. Williams, and H. Smith, Two dimensional dopant and carrier profiles obtained by scanning capacitance microscopy on an actively biased cross-sectioned metal?oxide?semiconductor field-effect transistor the measurement, characterization,and modeling of ultra-shallow doping profiles in semiconductors, Proceedings of the fifth international workshop on, pp.549-554, 2000.

P. De-wolf, W. Vandervorst, H. Smith, and N. Khalil, Comparison of two-dimensional carrier profiles in metal?oxide? semiconductor field-effect transistor structures obtained with scanning spreading resistance microscopy and inverse modeling measurement, characterization,and modeling of ultra-shallow doping profiles in semiconductors, Proceedings of the fifth international workshop on the, pp.540-544, 2000.

A. A. Requicha, S. Meltzer, F. P. Teran-arce, J. H. Makaliwe, H. Siken et al., Manipulation of nanoscale components with the AFM: principles and applications, Proceedings of the 2001 1st IEEE Conference on Nanotechnology. IEEE-NANO 2001 (Cat. No.01EX516), 2001.
DOI : 10.1109/NANO.2001.966398

S. Hsieh, S. Meltzer, C. R. Wang, A. A. Requicha, M. E. Thompson et al., Imaging and Manipulation of Gold Nanorods with an Atomic Force Microscope, The Journal of Physical Chemistry B, vol.106, issue.2, pp.231-234, 2002.
DOI : 10.1021/jp012747x

S. Decossas, F. Mazen, T. Baron, G. Bréemond, and A. Souifi, Atomic force microscopy nanomanipulation of silicon nanocrystals for nanodevice fabrication, Nanotechnology, vol.14, issue.12, pp.1272-1278, 2003.
DOI : 10.1088/0957-4484/14/12/008

R. Held, T. Heinzel, P. Studerus, K. Ensslin, and M. Holland, Semiconductor quantum point contact fabricated by lithography with an atomic force microscope, Applied Physics Letters, vol.71, issue.18, pp.712689-2691, 1997.
DOI : 10.1063/1.120137

M. Enachescu, R. J. Van-den-oetelaar, R. W. Carpick, D. F. Ogletree, C. F. Flipse et al., Atomic Force Microscopy Study of an Ideally Hard Contact: The Diamond(111)/Tungsten Carbide Interface, Physical Review Letters, vol.81, issue.9, pp.811877-1880, 1998.
DOI : 10.1103/PhysRevLett.81.1877

Y. P. Zhao, G. C. Wang, and T. M. Lu, Characterization of amorphous and cristallin rough surfaces -principles and applications. Experimental Methods in the Physical Science, 2000.

B. Hirrien, Rugosité de surface et d'interface : Méthodes de microscopie de force atomique et reflectivité de rayons-X rasants appliquées aux composants de la micro-´ electronique et de l'optronique, 1997.

M. A. Costa, Fractal description of rough surface for haptic display, 2000.

]. M. Ramonda, ´ Evolution dynamique de rugosité de surface lors de processus d'´ erosion et de croissance. ´ Etude par microscopie en champ proche, 1998.

D. Tabor and R. H. Wintherton, The Direct Measurement of Normal and Retarded van der Waals Forces, Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, vol.312, issue.1511, pp.312435-450, 1969.
DOI : 10.1098/rspa.1969.0169

J. Israëlachvili and D. Tabor, The Measurement of Van Der Waals Dispersion Forces in the Range 1.5 to 130 nm, Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, vol.331, issue.1584, pp.19-38, 1972.
DOI : 10.1098/rspa.1972.0162

J. Israëlachvili, Thin film studies using multiple-beam interferometry, Journal of Colloid and Interface Science, vol.44, issue.2, pp.259-272, 1973.
DOI : 10.1016/0021-9797(73)90218-X

A. Tonk, Développement d'un appareil de mesure des forces de surface et de nanoréologie, 1989.

A. Tonk, J. M. Georges, and J. L. Loubet, Measurement of intermolecular forces and the rehology of dodecane between alumina surfaces, Journal of Colloid and Interface Science, vol.126, issue.1, 1998.

F. Restagno, J. Crassous, E. Charlaix, C. Cottin-bizonne, and M. Monchanin, A new surface forces apparatus for nanorheology, Review of Scientific Instruments, vol.73, issue.6, pp.2292-2298, 2002.
DOI : 10.1063/1.1476719

F. Restagno, J. Crassous, E. Charlaix, M. Monchanin-]-l, K. Kogut et al., A new capacitive sensor for displacement measurement in a surface force apparatus. arXiv :cond-mat Analysis of interfacial adhesion based on electrical contact resistance measurements, Journal of Applied Physics, issue.10, pp.946386-6390, 2001.
URL : https://hal.archives-ouvertes.fr/hal-00122681

F. Ojeda, R. Cuerno, R. Salvarezza, and L. Vazquez, Dynamics of Rough Interfaces in Chemical Vapor Deposition: Experiments and a Model for Silica Films, Physical Review Letters, vol.84, issue.14, pp.3125-3128, 2000.
DOI : 10.1103/PhysRevLett.84.3125

H. Schröder, E. Obermeier, and A. Steckenborn, Micropyramidal hillocks on KOH etched {100} silicon surfaces: formation, prevention and removal, Journal of Micromechanics and Microengineering, vol.9, issue.2, pp.139-145, 1999.
DOI : 10.1088/0960-1317/9/2/309

W. Kern, Chemical etching of silicon, germanium, gallium, arsenide and gallium phosphide, RCA review, vol.39, pp.280-307, 1978.

F. Tardif, Gravure du silicium par voie humide. Expertise CEA conseil pour VACO Microtechnologies SCPM/00-403, 2000.

R. B. Darling, Etching chemistry. www.latech, 2001.

R. Iosub, C. Moldovan, and M. Modreanu, Silicon membranes fabrication by wet anisotropic etching. Sensors and Actuators -A, pp.104-111, 2002.
DOI : 10.1016/s0924-4247(01)00906-2

H. Siedel, L. Csepregi, A. Heuberger, and H. Baumgärtel, Anisotropic Etching of Crystalline Silicon in Alkaline Solutions, Journal of The Electrochemical Society, vol.137, issue.11, pp.3612-3626, 1990.
DOI : 10.1149/1.2086277

Z. Moktadir and K. Sato, Unstable etching of Si (110) with potassium hydroxide, Physical Review B, vol.64, issue.3, pp.1-4, 2001.

I. Zubel and M. Kramkowska, The effect of isopropyl alcohol on etching rate and roughness of (1 0 0) Si surface etched in KOH and TMAH solutions, Sensors and Actuators A: Physical, vol.93, issue.2, pp.138-147, 2001.
DOI : 10.1016/S0924-4247(01)00648-3

U. Schnakenberg, W. Benecke, and B. Löchel, NH4Oh-based etchants for silicon micromachining, Sensors and Actuators A: Physical, vol.23, issue.1-3, pp.21-231031, 1990.
DOI : 10.1016/0924-4247(90)87084-V

U. Schnakenberg, W. Benecke, and P. Lange, TMAHW etchants for silicon micromachining, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers, pp.815-818, 1991.
DOI : 10.1109/SENSOR.1991.149008

Y. Nemirovsky and A. El-bahar, The non equilibrium band model of silicon in TMAH and in anisotropic electrochemical alkaline etching solution. Sensors and Actuators -A, pp.205-214, 1999.

S. Naseh, L. M. Landsberger, M. Paranjape, and M. Kahrizi, Experimental investigations of anisotropic etching of Si in tetramethyl ammonium hydroxide, Presented at the Seventh Canadian Semiconductor Technologiy Conference, pp.79-84, 1995.
DOI : 10.1139/p96-837

M. Asano, T. Cho, and H. Muraoka, Application of choline in semiconductor technology, Electrochemical Society Fall Meeting -Extended abstract, 1976.

F. Secco-d-'aragona, Dislocation Etch for (100) Planes in Silicon, Journal of The Electrochemical Society, vol.119, issue.7, p.948, 1972.
DOI : 10.1149/1.2404374

F. Secco-d-'aragona, Annealing behavior and etching phenomena of microdefects in dislocation-free float-zone silicon, Physica Status Solidi (a), vol.22, issue.2, pp.577-582, 1971.
DOI : 10.1002/pssa.2210070232

M. Wright-jenkins, A new preferentiel etch for defects in silicon crystals, Journal of The Electrochemical Society, vol.145, issue.5, pp.757-762, 1977.

M. S. Kulkarni, J. Libbert, S. Keltner, and L. Muléstagno, A Theoretical and Experimental Analysis of Macrodecoration of Defects in Monocrystalline Silicon, Journal of The Electrochemical Society, vol.149, issue.2, pp.153-165, 2002.
DOI : 10.1149/1.1433473

A. R. Clawson, Guide to references on III???V semiconductor chemical etching, Materials Science and Engineering: R: Reports, vol.31, issue.1-6, pp.1-438, 2001.
DOI : 10.1016/S0927-796X(00)00027-9

H. F. Okorn-scmith, Characterization of silicon surface preparation processes for advanced gate dielectrics, IBM Journal of Research & Development, vol.43, issue.3, 1999.

M. A. Lester, Clean processing a remplacement for RCA clean. Semiconductor International, 2001.

R. A. Novak, W. J. Reightler, R. J. Robey, and R. E. Wildasin, Cleaning of precision components with supercritical carbondioxide, Conference Proceedings from the 1993 International CFC and Halon Alternatives Conference, pp.541-547, 1993.

C. Paillet and F. Tardif, Etude thermique du nettoyage Caro. rapport interne CEA LETI, 1995.

H. Lin, A. A. Busnaima, and I. I. Suni, Physical modeling of rinsing and cleaning of submicron trenches, International Interconnect Technology Conference, 2000.

D. S. Rimai, D. J. Quesnel, and A. A. Busnaina, The adhesion of dry particles in the nanometer to micrometer-size range, Colloids and Surfaces A: Physicochemical and Engineering Aspects, vol.165, issue.1-3, pp.3-10, 2000.
DOI : 10.1016/S0927-7757(99)00439-2

H. Takeshi, Trends in wafer cleaning technology, pp.437-450, 1998.

K. Hiroyuki, Wet cleaning (part 1) : Removal of particulate contaminants, pp.451-461, 1998.

W. Kern, The Evolution of Silicon Wafer Cleaning Technology, Journal of The Electrochemical Society, vol.137, issue.6, pp.1887-1892, 1990.
DOI : 10.1149/1.2086825

I. Mansart-constant, Mecanismes de retrait des contaminations particulaire et métallique sur les substrats de la microélectronique : optimisation des procedes de nettoyage après polissage mecano-chimique, Thèse de doctorat, 2000.

M. Pourbaix, Atlas d'´ equilibré electrochimique. Gauthier-Villars, Paris, Gauthier-Villars et cié editeur edition, 1963. [229] F. Tardif. Nettoyages par voies humide en micro-´ electronique, Caractérisation et Nettoyage du silicium : caractérisation physico-chimique et nettoyage par voie humide

S. Verhaverbeke, Dielectric breakdown in thermally grown oxide layer Faculteit oegepaste wetenschappen, departement elektrotechniek, Afdeling esat -Divisieinsys, Kardinaal Mercierlaan, Thèse de doctorat, pp.94-3001, 1993.

J. Aué and J. T. De-hosson, Influence of atomic force microscope tip-sample ointeraction on the study of scaling behavior, Applied Physics Letters, issue.10, pp.711347-1349, 1997.

J. Chen, L. Liu, Z. Li, Z. Tan, Q. Jiang et al., Study of anisotropic etching of (1 0 0) Si with ultrasonic agitation, Sensors and Actuators A: Physical, vol.96, issue.2-3, pp.152-156, 2002.
DOI : 10.1016/S0924-4247(01)00786-5

W. K. Choi, J. T. Thong, P. Luo, Y. Bai, C. M. Tan et al., Formation of pyramids at surface of TMAH etched silicon, Applied Surface Science, vol.144, issue.145, pp.144-145472, 1999.
DOI : 10.1016/S0169-4332(98)00842-3

J. T. Thong, P. Luo, W. K. Choi, and S. C. Tan, Evolution of hillocks during silicon etching in TMAH, Journal of Micromechanics and Microengineering, vol.11, issue.1, pp.61-69, 2001.
DOI : 10.1088/0960-1317/11/1/310

M. J. Declercq, L. Gerzberg, and J. D. , Optimization of the Hydrazine-Water Solution for Anisotropic Etching of Silicon in Integrated Circuit Technology, Journal of The Electrochemical Society, vol.122, issue.4, pp.545-552, 1975.
DOI : 10.1149/1.2134257

P. H. Chen, H. Y. Peng, C. M. Hsieh, and M. K. Chyu, The characteristic behavior of TMAH water solution for anisotropic etching on both Silicon substrate and SiO2 layer, Sensors and Actuators A: Physical, vol.93, issue.2, pp.132-137, 2001.
DOI : 10.1016/S0924-4247(01)00639-2

A. Louro and J. R. Senna, <title>Real-time in-situ microscopic observation of bubbles and roughening in KOH etching of silicon</title>, Micromachining and Microfabrication Process Technology VII, 2001.
DOI : 10.1117/12.442954

E. Van-veenendaal, K. Sato, M. Shikida, A. J. Nijdam, and J. Van-suchtelen, Micromorphology of single crystalline silicon surfaces during anisotropic wet chemical etching in KOH and TMAH, Sensors and Actuators A: Physical, vol.93, issue.3, pp.232-242, 2001.
DOI : 10.1016/S0924-4247(01)00655-0

T. Baum and D. J. Schiffrin, AFM trudy of surface finish improvement by ultrasound in the anisotropic etching of Si <100> in KOH for micromachining applications, Journal of Micromechanics and Microengineering, vol.7, issue.4, pp.338-342, 1997.
DOI : 10.1088/0960-1317/7/4/010

K. Sakaino and S. Adachi, Properties of Silicon (111) and (100) Surfaces Etched in Choline Solution, Journal of The Electrochemical Society, vol.149, issue.9, pp.543-549, 2002.
DOI : 10.1149/1.1498843

D. Resnik, D. Vrtacnik, U. Aljancic, and S. Amon, Effective roughness reduction of ??100?? and ??311?? planes in anisotropic etching of ??100?? silicon in 5?? TMAH, Journal of Micromechanics and Microengineering, vol.13, issue.1, pp.26-34, 2003.
DOI : 10.1088/0960-1317/13/1/304

R. E. Oosterbroek, J. W. Berenschot, H. V. Jansen, A. J. Nijdam, G. Pandraud et al., Etching methodologies in <111>-oriented silicon wafers, Journal of Microelectromechanical Systems, vol.9, issue.3, pp.390-398, 2000.
DOI : 10.1109/84.870065

E. Steinsland, T. Finstad, and A. Hanneborg, Etch rates of (100), (111) and (110) single-crystal silicon in TMAH measured in situ by laser reflectance interferometry, Sensors and Actuators A: Physical, vol.86, issue.1-2, pp.73-80, 2000.
DOI : 10.1016/S0924-4247(00)00309-5

M. Börner, S. Landau, S. Metz, and B. O. Kolbesen, Influence of copper on the oxide growth of Si Crystalline defects and contamination : their impact and control in device manufacuring II, pp.97-119, 1997.

M. Morita, T. Ohmi, E. Hasegawa, M. Kawakami, and M. Ohwada, Growth of native oxide on a silicon surface, Journal of Applied Physics, vol.68, issue.3, pp.1272-1281, 1990.
DOI : 10.1063/1.347181

M. Morita, Native oxyde films and chemical oxide films, Ultraclean Surface Processing of Silicon Wafers. Secrets of VLSI manufacturing, pp.543-558, 1998.
DOI : 10.1007/978-3-662-03535-1_42

L. Léger and H. Hervet, FrictionàFrictionà linterface entre un fluide polymère et un solide. www. spm.cnrs-dir.fr/actions, 2000.

V. Subramanian, Effects of long-chain surfactants, short-chain alcohols and hydrolizable cations on the hydrophobic and hydratation forces, 1998.

J. Bico, Mécanismes d'imprégnation : Surfaces texturées, Bigouttes, Poreux, 2000.

F. Tardif, F. De-bourmond, T. Vareine, and V. Oravec, A Novel Rinsing Tank Concept to Save DI Water Using an Internal Recirculation Flow: 'Circle Stream Rinser', Ultra clean Processing of Silicon Surfaces, pp.191-194, 2001.
DOI : 10.4028/www.scientific.net/SSP.76-77.191

O. Raccurt, F. Tardif, L. Kerber, T. Lardin, and T. Vareine, A novel tank for DI water reduction in MEMS manufacturing, Journal of Micromechanics and Microengineering, vol.13, issue.3, pp.442-446, 2003.
DOI : 10.1088/0960-1317/13/3/314

R. Chiarello, R. Parker, and M. Tritapoe, Optimizing wafer rinsing processes to conserve di water. Micro Magazine : Surface Chemistries, 2000.

A. D. Hebda, K. A. Romero, D. M. Seif, and T. W. Peterson, Fundamentals of upw rinse : analysis of chemical removal from flat and patterned wafer surfaces Cleaning technology in semiconductor device manufacturing VI, pp.99-135, 2000.

T. Nicolosi, M. Olesen, V. George, T. Patel255, ]. K. Romero et al., Front end of line wet processing for advenced critical cleans Cleaning technology in semiconductor device manufacturing VI In-situ analysis of wafer surface and deep trenche rinse, Cleaning technology in semiconductor device manufacturing VI, pp.99-135, 2000.

O. Raccurt, F. Arnaud-d-'avitaya, E. Charlaix, T. Vareine, and F. Tardif, A New Industrial Etching & Drying Process for MEMS to Prevent Collapse of Microstructures, Solid State Phenomena, Ultra Clean Processing of Silicon Surface V -2002 proceedings, pp.73-76, 2003.
DOI : 10.4028/www.scientific.net/SSP.92.73

E. Bertrand, Transitions de mouillage des alcanes sur l'eau : rôle des interactions entre interfaces. spécialité : physique des liquides, 2000.

]. F. Tardif, ´ Etude des procédés de nettoyage des substrats de silicium en microélectronique

O. Raccurt, F. Tardif, E. Charlaix-]-o, F. Raccurt, E. Arnaud-d-'avitaya et al., Contraintes liées au séchage des microsystémes : ´ etude du collage A New Industrial Etching & Drying Process For MEMS to Prevent Collapse of Microstructures , présenté a Ultra Clean Processing on Silicon Surface, présenté aux Journées Nationales du Réseau des Doctorants en Microélectronique UCPSS 2002 proceedings, pp.73-76, 2002.

O. Raccurt, F. Tardif, L. Kerber, T. Lardin, T. Vareine et al., Water reduction in MEMS manufacturing Nano-texturation du Silicium par Gravure Humide : Application au Séchage des Microsystémes, présenté au Congrès Générale de la Société Française de Physique Influence of liquid surface tension on stiction of SOI MEMS Understanding of wet and alternative particle removal processes in microelectronics : theoretical capabilities and limitation, Etude de la rugosiffcation du silicium par voie humide. Application au séchage des microsystèmes, présenté aux Journées Nationales du Réseau des Doctorants en Microélectronique présenté au 6th Symposium Diagnostics and Yield : Advanced Silicon Devices and Technologies for ULSI Era Mechanical resistance of fine microstructures related to particle cleaning mechanism, présenté a Electro-Chemical Society meeting octobre, pp.442-446, 2003.

Z. Moktadir and K. Sato, Unstable etching of Si(110) with potassium hydroxide, 2001.

L. Mule and . Stagno, A technique for delneating defect in silicon. Solid State Phenomena, pp.82-84753, 2002.

O. Raccurt, F. Tardif, and E. Charlaix, Contraintes liées au séchage des microsystèmes : ´ etude du collage, Journées National du Réseau des Doctorants en Microélectronique, 2002.

S. Verhaverbeke, Dielectric breakdown in thermally grown oxide layer Faculteit oegepaste wetenschappen, departement elektrotechniek , Afdeling esat -Divisieinsys, Kardinaal Mercierlaan, Thèse de doctorat, pp.94-3001, 1993.

R. L. Alley, G. J. Cuan, R. Howe, and K. Konvopoulos, The effect of release-etch processing on surface microstructure stiction Solid-State Sensors and Actuator workshop, pp.202-209, 1992.

C. H. Mastrangelo and C. Hsu, Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theory, Journal of Microelectromechanical Systems, vol.2, issue.1, pp.33-43, 1993.
DOI : 10.1109/84.232593

C. H. Mastrangelo and C. Hsu, Mechanical stability and adhesion of microstructures under capillary forces. II. Experiments, Journal of Microelectromechanical Systems, vol.2, issue.1, pp.44-55, 1993.
DOI : 10.1109/84.232594

C. Mastrangelo, Adhesion related failure mechanisms in micromechanical devices (invited paper) Trib, Lett, vol.3, pp.223-261, 1997.

R. Maboudian and R. Howe, Critical Review: Adhesion in surface micromechanical structures, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.15, issue.1, pp.1-20, 1997.
DOI : 10.1116/1.589247

W. P. Van-spendgen, R. Puers, D. Wolf, and I. , A physical model to predict stiction in MEMS, Journal of Micromechanics and Microengineering, vol.12, issue.5, pp.702-715, 2002.
DOI : 10.1088/0960-1317/12/5/329

Z. Rymuza, Control tribological and mechanical properties of MEMS surfaces. Part 1: critical review, Microsystem Technologies, vol.5, issue.4, pp.173-80, 1999.
DOI : 10.1007/s005420050160

T. Abe and M. Reed, Control of liquid bridging induced stiction of micromechanical structures, Journal of Micromechanics and Microengineering, vol.6, issue.2, pp.213-219, 1996.
DOI : 10.1088/0960-1317/6/2/002

O. Raccurt, D. Aranaud, F. Avitaya, E. Charlaix, T. Vareine et al., A new industrial etching & drying process for MEMS to prevent collapse of microstructures Presented at Ultra Clean Processing on Silicon Surface, Proc. UCPSS, pp.73-79, 2002.

R. Comolet, Mécanique expérimentale des fluides, 1982.

M. O. Neill, A sphere in contact with a plane wall in a slow linear shear flow, Chemical Engineering Science, vol.23, issue.11, p.1293, 1968.
DOI : 10.1016/0009-2509(68)89039-6

]. P. References-[-bes01, O. Besson, G. Keller, ]. A. Chingbus93, J. Busnaina et al., Measurement of the adhesion and removal forces of sub micrometer particles on silicon substrates Surface acceleration during dry laser cleaning of siliconPrinciple of Colloid and Surface Chemistry Microscopic analysis of particle removal by gas/liquid mixture high-speed flow, UCPSS'98 Microscopic analysis of particle removal by gas/liquid mixture high-speed flow, UCPSS'98 On laser induced bubble near a solid boundary: contribution to the understanding of erosion phenomena Surface acoustic cavitation understood via nanosecond electrochemistry, Particle removal evaluation in DI water with megasonic activation, Semicon Europa technical session Puotinen, Cleaning solutions based on hydrogen peroxide for use in silicon Semiconductor industry, RCA review 31One68] M. O'Neill, A sphere in contact with a plane wall in a slow linear shear flow, pp.335-337, 1968.

P. Fleury, D. Patruno, K. Levy, and . Barla, Optimization of HF and oxidant wet cleanings before 7 nm gate oxide : Introduction to "DDC" : Diluted Dynamic Clean ECS Chicago, 1995.

I. Matthews, R. Kashkoush, and . Novak, Performances ofDDC": Diluted Dynamic Clean before 4.5 nm gate oxide, ECS Paris, Sept, vol.97, 1997.

A. Delville and . New, Nettoyages par voie humide en micro-électronique dans l'ouvrage "Procédés de fabrication en micro-électronique, electrostatic interactions 7 th International Symposium on Particles on surfaces Thompson and L.K. Doraiswamy, Sonochemistry: Science and Engineering, 2000.

C. Verhaverbeke, H. Schmidt, M. Meuris, P. W. Mertens, M. M. Heyns et al., Technical conferences, Semicon Europe Wafer cleaning with cryogenic argon aerosols The modeling of excimer laser particle removal from hydrophilic silicon surfaces Resuspension of particulates from surfaces to turbulent flows Review and analysis, Semicon. Int. J. App. Phys. J. Aerosol Sci, vol.38, issue.26, pp.1215-1249, 1993.