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Techniques de conception pour le durcissement des circuits intégrés face aux rayonnements

Abstract : Integrated microsystems are the latest development of microelectronics. Their appearance allows a host of revolutionary new applications in several fields, including space exploration. The use of microsystems in space is hampered by the problem of exposure to radiation, particularly for the electronics section. This problem has been overcome in the past through the development of special fabrication technologies (" hardened "), able to resist the effects of radiation. The cutback in the military budgets has been responsible for the extinction of most radiation-hardened technologies. This fact is pushing the space industry towards the use of commercial off-the-shelf (COTS) technologies. The purpose of this thesis is to explore design techniques for the radiation-hardening of an integrated microsystem fabricated on a COTS technology. This microsystem is an infra-red sensor based on silicon thermopiles, suspended by front-side bulk micromachining. The pertinent elements of the different domains of knowledge needed for this task are reviewed, with an analysis of the hardening techniques applicable to the realization of the read-out electronics in CMOS technology. An experimental characterization program was carried out, and it has allowed to establish precisely the level of radiation tolerance of the technology, as well as to evaluate the usefulness of the design techniques developed. The excellent results obtained gave impulse to the endeavor of fabricating the whole sensor read-out chain. This chain was designed, manufactured, tested and qualified for space use.
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https://tel.archives-ouvertes.fr/tel-00003047
Contributor : Lucie Torella <>
Submitted on : Wednesday, June 25, 2003 - 9:04:34 AM
Last modification on : Thursday, November 19, 2020 - 3:56:18 PM
Long-term archiving on: : Friday, April 2, 2010 - 6:55:53 PM

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  • HAL Id : tel-00003047, version 1

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UJF | TIMA | CNRS | UGA

Citation

F. Vinci dos Santos. Techniques de conception pour le durcissement des circuits intégrés face aux rayonnements. Micro et nanotechnologies/Microélectronique. Université Joseph-Fourier - Grenoble I, 1998. Français. ⟨tel-00003047⟩

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