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Modélisation de fautes et conception en vue du test structurel des microsystèmes

Abstract : MEMS are electromechanical devices fabricated with microelectronic technological processes at micron scale. They share on the same substrate sensors, actuators and electronic interfaces (analogue, digital and mixed-signal circuits). As for integrated circuits, MEMS testing is an important step to achieve a good level of quality and reliability. The purpose of this work is to transpose structural testing techniques for integrated circuits to MEMS. Such techniques include fault simulation and design-for-test. Fault simulation allows the generation of specific test stimuli targeting real defects that can affect the behaviour of the device. The first step has been to study MEMS failures mechanisms and defects for two different standard MEMS technologies. Once defects have been classified, we focused on fault modeling and fault injection at different levels of MEMS modeling. Design-for-test is a set of techniques that ease the production test step by insertion in the design of specific circuitry. Concerning MEMS, we focus on the development of self-testing components by an on-chip generation of electrically induced physical stimuli. We apply such a self-test approach to two different MEMS applications : a thermopile-based infrared sensor and a microbeam-based fingerprint sensor. In both cases, the design components considered make structural testing possible without needing external physical stimuli.
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Contributor : Lucie Torella <>
Submitted on : Tuesday, June 3, 2003 - 5:40:09 PM
Last modification on : Friday, December 11, 2020 - 8:28:03 AM
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  • HAL Id : tel-00002936, version 1




B. Charlot. Modélisation de fautes et conception en vue du test structurel des microsystèmes. Autre [cs.OH]. Institut National Polytechnique de Grenoble - INPG, 2001. Français. ⟨tel-00002936⟩



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