Smart Integrated Electronic Systems

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Calibration Thermal sensor Power demand Analytical models Bioimpedance spectroscopy Alternate testing Carbon nanotubes Secure IC Test efficiency Built-In-Self-Test CMOS Side-channel analysis Electrothermal analysis Integrated circuit noise Analog/RF integrated circuits Copper Integrated circuit modeling Analog signals Circuit Monitoring Integrated circuit design Carbon nanotube interconnects MEMS RF test Capacitors Logic gates Integrated circuits Sensors Time-domain analysis Integrated circuit interconnections Heating Delays Test cost reduction Biosensor Digital signal processing Temperature distribution SRAM BIST Process variability Correlation Digital modulation Design RSA Reliability Accelerometers Integrated circuit reliability Low-cost measurements Digital ATE Education Specifications Bioimpedance Three-dimensional displays Phase shifter Computer architecture Cu-CNT composites Bandwidth 3D integration Low power Noise measurement Convective accelerometer Magnetic tunneling One bit acquisition 1-bit acquisition ATE programming Current conveyor Carbon nanotube 3D Through-silicon vias Data fusion Three-dimensional integrated circuits Digital electronic circuits Clocks Analog/IF signals FDSOI technology COTS Power supplies Analog and RF integrated circuits SEU Brainstorming Microprocessors Switches Transistors OQPSK Delay variation Automatic test pattern generation CMOS memory circuits Evaluation Circuit faults Indirect testing Accelerometer Competencies Advanced PMA STT-MRAM Noise Current mirror Phase noise Alternate test Critical path delay Integrated circuit testing Test Circuits