Fiche détaillée

Communications avec actes

(2001)

Global modeling and simulation of System-on-Chip embedding MEMS devices

Z. Juneidi1, K. Torki1, S. Martinez1, G. Nicolescu1, B. Courtois1, A.A. Jerraya1

Systems-on-Chip (SoC) and Systems-on-Package (SoP) are becoming more and more heterogeneous systems. In order to validate systems containing such a variety of components, global multi-domain simulation of different aspects becomes especially important. Hardware/software, analog/digital, and electronic/mechanical/optic mixed simulations must be accessible. This paper presents a methodology to establish an environment for the global modeling and simulation of system-on-chip embedding MEMS devices. This methodology is illustrated in two co-simulation frameworks: the optical cross-connect co-simulation framework and the electro-thermal co-simulation framework.

1 :	TIMA - Techniques of Informatics and Microelectronics for integrated systems Architecture

Mots Clés : SoC-embedding-MEMS-devices – global-modeling – global-simulation – system-on-chip – system-on-package – global-multi-domain-simulation – optical-cross-connect-co-simulation-framework – electro-thermal-co-simulation-framework – high-level-design-validation – package-electro-thermal-modeling – IC-package-thermal-co-simulation

hal-00007835, version 1

http://hal.archives-ouvertes.fr/hal-00007835

oai:hal.archives-ouvertes.fr:hal-00007835

Contributeur : Lucie Torella <>

Soumis le : Mardi 9 Août 2005, 09:17:35

Dernière modification le : Jeudi 30 Mars 2006, 15:21:55