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5th International Workshop on THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES (THERMINIC 1999), October 3-6, 1999, ROME, Italy: Special Issue, Microelectronics Journal (2000) Volume 31, Issues 9-10, 725-824

5th International Workshop on THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES (THERMINIC 1999), October 3-6, 1999, ROME, Italy: Special Issue, Microelectronics Journal

M. Rencz1, B. Courtois2, C. Lasance3, V. Szekely1

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics and microstructures. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system.

1:	TU BUDAPEST - Technical University Budapest
2:	TIMA - Techniques of Informatics and Microelectronics for integrated systems Architecture
3:	Philips, The Netherlands

Keyword(s) : microsystems – thermal modeling

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From: Lucie Torella <>

Submitted on: Tuesday, 10 January 2006 14:24:23

Updated on: Friday, 10 February 2006 10:12:08