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TIMA (Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés) est un laboratoire public de recherche sous la tutelle du Centre National de la Recherche Scientifique (CNRS), de l’Institut Polytechnique de Grenoble (Grenoble INP), et de l’Université Grenoble Alpes (UGA). La recherche à TIMA se compose de 4 équipes (2020) :
AMfoRS [2020-….] (Architectures and Methods for Resilient Systems)
CDSI [2020-….] (Circuits, Devices and System Integration)
RMS [2020-….] (Reliable Mixed-signal Systems)
SLS [2020-….] (System Level Synthesis)
Derniers dépôts
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Aïcha Saïd, Frédéric Hameau, Rémy Vauché, Alexandre Siligaris, Florence Podevin, et al.. A millimeter wave high isolation resistive coupler In 45nm RFSOI technology for sensing application. APMC 2023 - 2023 Asia-Pacific Microwave Conference, Dec 2023, Tapei, China. pp.611-613, ⟨10.1109/APMC57107.2023.10439902⟩. ⟨hal-04524621⟩
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Nasr-Eddine Ouldei Tebina, Aghiles Douadi, Luc Salvo, Vincent Beroulle, Nacer-Eddine Zergainoh, et al.. Non-Invasive Attack on Ring Oscillator-based PUFs through Localized X-Ray Irradiation. IEEE International Symposium on Hardware Oriented Security and Trust (HOST 2024), May 2024, Washington, DC, United States. ⟨hal-04521587⟩
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Éric Tournié, Jean-Marc Allain, Mathieu Arnoux, Nathalie Bardou, Skandar Basrour, et al.. Rapport d’évaluation de l’unité FEMTO-ST – Franche-Comté Électronique, Mécanique, Thermique et Optiques - Sciences et Technologies : Sciences et Technologies. Campagne d’évaluation 2022-2023. C2023-EV-0251215K-DER-PUR230023102-RF, Hcéres. 2023. ⟨hal-04505233⟩
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Olivier Lim, Stéphane Mancini, Mauro Dalla Mura. Potential of an Embedded Hyperspectral Compressive Imaging System for Remote Sensing Applications. IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium, Jul 2023, Pasadena, United States. pp.4238-4241, ⟨10.1109/IGARSS52108.2023.10282751⟩. ⟨hal-04281798⟩
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Julie Roux, Katell Morin-Allory, Vincent Beroulle, Lilian Bossuet, Frederic Cezilly, et al.. FMEA on Critical Systems: a Cross-layer Approach based on High-Level Models. 29th IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip (VLSI-SoC), Oct 2021, Singapore, Singapore. pp.113-134. ⟨hal-04419787v2⟩